发明授权
US06906384B2 Semiconductor device having one of patterned SOI and SON structure
失效
具有图案化SOI和SON结构之一的半导体器件
- 专利标题: Semiconductor device having one of patterned SOI and SON structure
- 专利标题(中): 具有图案化SOI和SON结构之一的半导体器件
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申请号: US10096655申请日: 2002-03-14
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公开(公告)号: US06906384B2公开(公告)日: 2005-06-14
- 发明人: Takashi Yamada , Tsutomu Sato , Shinichi Nitta , Hajime Nagano , Ichiro Mizushima , Hisato Oyamatsu , Yoshihiro Minami , Shinji Miyano , Osamu Fujii
- 申请人: Takashi Yamada , Tsutomu Sato , Shinichi Nitta , Hajime Nagano , Ichiro Mizushima , Hisato Oyamatsu , Yoshihiro Minami , Shinji Miyano , Osamu Fujii
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权: JP2002-035681 20020213
- 主分类号: H01L21/76
- IPC分类号: H01L21/76 ; H01L21/762 ; H01L21/764 ; H01L21/8234 ; H01L21/8242 ; H01L21/84 ; H01L27/08 ; H01L27/088 ; H01L27/10 ; H01L27/108 ; H01L27/12 ; H01L29/786 ; H01L27/01
摘要:
A semiconductor device includes first and second semiconductor layers and first and second MOS transistors. The first semiconductor layer is provided on and electrically connected to the semiconductor substrate. The second semiconductor layer is provided near the first semiconductor layer and formed above the semiconductor substrate via one of an insulating film and a cavity. The first and second MOS transistors are respectively provided on the first and second semiconductor layers, and each has a gate electrode arranged parallel to a boundary between the first and second semiconductor layers.
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