Invention Grant
- Patent Title: Micromechanical component
- Patent Title (中): 微机械部件
-
Application No.: US10381307Application Date: 2002-07-06
-
Publication No.: US06906392B2Publication Date: 2005-06-14
- Inventor: Hubert Benzel , Heribert Weber , Michael Bauer , Hans Artmann , Thorsten Pannek , Frank Schaefer , Christian Krummel
- Applicant: Hubert Benzel , Heribert Weber , Michael Bauer , Hans Artmann , Thorsten Pannek , Frank Schaefer , Christian Krummel
- Applicant Address: DE Delbruck
- Assignee: paragon
- Current Assignee: paragon
- Current Assignee Address: DE Delbruck
- Agency: Kenyon & Kenyon
- Priority: DEPCT/DE02/02480 20020706
- International Application: PCT/DE02/02480 WO 20020706
- International Announcement: WO03/01242 WO 20030213
- Main IPC: B81B3/00
- IPC: B81B3/00 ; G01N27/04 ; G01N27/12 ; G01N27/18 ; G01N27/22 ; H01L27/14 ; G01N7/00
Abstract:
A micromechanical component includes a substrate and a cover layer deposited on the substrate, underneath the cover layer, a region of porous material being provided which mechanically supports and thermally insulates the cover layer. On the cover layer, a heating device is provided to heat the cover layer above the region; and above the region, a detector is provided to measure an electric property of a heated medium provided above the region on the cover layer.
Public/Granted literature
- US20040021184A1 Micromechanical component Public/Granted day:2004-02-05
Information query
