发明授权
- 专利标题： Plasma processing apparatus and method
- 专利标题（中）： 等离子体处理装置及方法
-
申请号： US10087771申请日： 2002-03-05
-
公开(公告)号： US06908529B2公开(公告)日： 2005-06-21
- 发明人: Hideyuki Yamamoto , Akira Kagoshima , Shoji Ikuhara , Daisuke Shiraishi , Junichi Tanaka
- 申请人： Hideyuki Yamamoto , Akira Kagoshima , Shoji Ikuhara , Daisuke Shiraishi , Junichi Tanaka
- 申请人地址： JP Tokyo
- 专利权人： Hitachi High-Technologies Corporation
- 当前专利权人： Hitachi High-Technologies Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP
- 主分类号： B01J19/08
- IPC分类号： B01J19/08 ; H01J37/32 ; H01L21/00 ; H01L21/3065 ; H05H1/00 ; C23C16/00 ; C23F1/00
摘要：
A plasma processing system for processing a workpiece by using plasma generated in a chamber, includes a light transmissive member disposed in the chamber, the workpiece being disposed inside the light transmissive member; and a light receiving unit mounted on the chamber for receiving light inside the light transmissive member, wherein a state of processing the workpiece is detected by using data detected from light inside the light transmissive member before processing the workpiece and data detected from light inside the light transmissive member generated during processing the workpiece. A plasma processing method and system is provided which facilitates an operation of the system and executes a reliable processing.
公开/授权文献
- US20030170984A1 Plasma processing apparatus and method 公开/授权日：2003-09-11
信息查询
