发明授权
- 专利标题： Method and apparatus to improve thickness uniformity of surfaces for integrated device manufacturing
- 专利标题（中）： 提高集成器件制造的表面厚度均匀性的方法和装置
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申请号： US10325353申请日： 2002-12-19
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公开(公告)号： US06927169B2公开(公告)日： 2005-08-09
- 发明人: Dan Maydan , Randhir Thakur
- 申请人： Dan Maydan , Randhir Thakur
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials Inc.
- 当前专利权人： Applied Materials Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Moser, Patterson & Sheridan, LLP
- 主分类号： H01L21/28
- IPC分类号： H01L21/28 ; H01L21/314 ; H01L21/316 ; H01L21/84 ; H01L21/311
摘要：
A method and apparatus for the formation of oxide in a manner having a planarizing effect on underlying material, e.g., silicon. In particular, an oxide having a nonuniform thickness profile is grown on the underlying material. The nonuniform thickness profile of the oxide is selected according to the nonuniform profile of the underlying material. Subsequent removal of the oxide leaves behind a planarized surface of the underlying material, as compared to the pre-oxidized surface.
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