发明授权
- 专利标题： Method and apparatus for inspecting pattern defects
- 专利标题（中）： 检查图案缺陷的方法和装置
-
申请号： US10218463申请日： 2002-08-15
-
公开(公告)号： US06927847B2公开(公告)日： 2005-08-09
- 发明人: Minoru Yoshida , Shunji Maeda , Atsushi Shimoda , Kaoru Sakai , Takafumi Okabe
- 申请人： Minoru Yoshida , Shunji Maeda , Atsushi Shimoda , Kaoru Sakai , Takafumi Okabe
- 申请人地址： JP Tokyo
- 专利权人： Hitachi High-Technologies Corporation
- 当前专利权人： Hitachi High-Technologies Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP
- 优先权： JP2001-277681 20010913
- 主分类号： G01N21/00
- IPC分类号： G01N21/00 ; G01N21/95 ; G01N21/956 ; G01N21/88
摘要：
An apparatus for inspecting pattern defects on microscopic circuit patterns, with high resolution, comprises: an objective lens for detecting an image of a sample; a UV laser beam illumination arrangement for illuminating onto a pupil of the objective lens; am arrangement for lowering coherency of the UV laser illumination; a detector of integration type; and an arrangement for processing detected signal thereof.
公开/授权文献
- US20030048439A1 Method and apparatus for inspecting pattern defects 公开/授权日：2003-03-13