Invention Grant
- Patent Title: Structure and method for field emitter tips
- Patent Title (中): 场发射器尖端的结构和方法
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Application No.: US10193016Application Date: 2002-07-09
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Publication No.: US06933665B2Publication Date: 2005-08-23
- Inventor: Terry L. Gilton , Paul A. Morgan
- Applicant: Terry L. Gilton , Paul A. Morgan
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg, Woessner & Kluth, P.A.
- Main IPC: H01J1/05
- IPC: H01J1/05 ; H01J1/14 ; H01J1/304 ; H01J1/38 ; H01J1/48 ; H01J9/02 ; H01J9/38 ; H01J19/06 ; H01L21/00

Abstract:
Improved methods and structures are provided for an array of vertical geometries which may be used as emitter tips, as a self aligned gate structure surrounding field emitter tips, or as part of a flat panel display. The present invention offers controlled size in emitter tip formation under a more streamlined process. The present invention further provides a more efficient method to control the gate to emitter tip proximity in field emission devices. The novel method of the present invention includes implanting a dopant in a patterned manner into the silicon substrate and anodizing the silicon substrate in a controlled manner causing a more heavily doped region in the silicon substrate to form a porous silicon region.
Public/Granted literature
- US20020175608A1 Structure and method for field emitter tips Public/Granted day:2002-11-28
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