发明授权
- 专利标题： Method and apparatus for wet-cleaning substrate
- 专利标题（中）： 湿法清洗基材的方法和装置
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申请号： US10898366申请日： 2004-07-26
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公开(公告)号： US06938626B2公开(公告)日： 2005-09-06
- 发明人: Yasuhito Inagaki
- 申请人： Yasuhito Inagaki
- 申请人地址： JP
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP
- 代理机构： Rader, Fishman & Grauer PLLC
- 代理商 Ronald P. Kananen
- 优先权： JPP2000-341092 20001108; JPP2000-341093 20001108; JPP2000-341094 20001108; JPP2000-363155 20001129; JPP2000-369632 20001205
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; B08B3/08 ; C11D7/08 ; C11D7/10 ; C11D11/00 ; H01L21/00 ; H01L21/66 ; B08B3/00
摘要：
An apparatus for wet cleaning a substrate includes a clean air supplier for supplying the clean air into a cleaning draft, a humidifier for supplying steam or mist like water drops into the cleaning draft, a hygrometer, connected to the humidifier and positioned at the level of the cleaning solution, an exhaust piping and an exhaust rate control means.
公开/授权文献
- US20050000545A1 Method and apparatus for wet-cleaning substrate 公开/授权日：2005-01-06
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