A heating apparatus having an electrostatic adsorption function comprising at least a supporting substrate, an electrode for electrostatic adsorption and a heating layer formed on the supporting substrate, and an insulating layer formed so as to cover the electrode for electrostatic adsorption and the heating layer, wherein a surface roughness of the insulating layer satisfies Ra≦0.05 μm and Rmax≦0.6 μm, and Vickers hardness of the surface of the insulating layer is 10 GPa or less. Thus, there can be provided a heating apparatus having an electrostatic adsorption function in which scratches are not generated on a silicon wafer or the like and the generation of particles can be suppressed when heating/cooling the wafer or the like.