发明授权
- 专利标题: Thin film semiconductor device having arrayed configuration of semiconductor crystals and a method for producing it
- 专利标题(中): 具有半导体晶体排列构造的薄膜半导体器件及其制造方法
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申请号: US10293939申请日: 2002-11-14
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公开(公告)号: US06953714B2公开(公告)日: 2005-10-11
- 发明人: Yoshinobu Kimura , Masakiyo Matsumura , Mikihiko Nishitani , Masato Hiramatsu , Masayuki Jyumonji , Yoshitaka Yamamoto , Hideo Koseki
- 申请人: Yoshinobu Kimura , Masakiyo Matsumura , Mikihiko Nishitani , Masato Hiramatsu , Masayuki Jyumonji , Yoshitaka Yamamoto , Hideo Koseki
- 申请人地址: JP Yokohama
- 专利权人: Advanced LCD Technologies Development Center Co., Ltd.
- 当前专利权人: Advanced LCD Technologies Development Center Co., Ltd.
- 当前专利权人地址: JP Yokohama
- 代理机构: Morrison & Foerster LLP
- 优先权: JP2001-390619 20011119
- 主分类号: H01L21/20
- IPC分类号: H01L21/20 ; H01L21/268 ; H01L21/336 ; H01L29/786 ; H01L21/00 ; H01L21/84
摘要:
A method for producing a thin film semiconductor device is described. In the method, a thin film layer of non-single-crystalline semiconductor, which is deposited on a base layer of glass, is processed to an island-shaped thin film layer at the time prior to the layer irradiation step. The laser irradiation to the thin film layer of non-single-crystalline semiconductor is carried out after forming an insulation film layer and a gate electrode over the island-shaped thin film layer, by using the gate electrode as the irradiation mask, whereby the center area of the island-shaped thin film layer masked by the gate electrode is crystallized, and simultaneously, the both side areas thereof which is not masked by the gate electrode are annealed. Next, a source electrode and a drain electrode is formed in the annealed areas. The implantation of impurity ion may be carried out either before or after the laser irradiation. By the above order of steps, it becomes possible to obtain a thin film semiconductor device which has small numbers of crystals and less variance of grain size of crystals for each unit of electric circuit, compared with a device produced by the conventional process. Further, the process makes it possible to be even the boundary surface between the crystallized layer and the insulation layer in a device.
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