Manufacturing method of semiconductor device
    1.
    发明授权
    Manufacturing method of semiconductor device 有权
    半导体器件的制造方法

    公开(公告)号:US08034696B2

    公开(公告)日:2011-10-11

    申请号:US11802048

    申请日:2007-05-18

    IPC分类号: H01L21/20

    CPC分类号: C30B23/00 C30B25/00

    摘要: It is an object of the present invention to provide a method of manufacturing an SOI wafer at low cost and with high yield. It is another object of the present invention to provide a semiconductor device including also bulk type MISFETs used as high voltage regions and a method of manufacturing the same without using complicated processes and increasing the size of a semiconductor chip.The method of manufacturing a semiconductor device comprises selectively epitaxially growing a single-crystal Si layer and continuously performing the epitaxial growth without bringing a substrate temperature increased during the growth to room temperature even once. An epitaxially grown surface is then etched and planarized. The substrate temperature is then cooled down to the room temperature.

    摘要翻译: 本发明的目的是提供一种以低成本和高产率制造SOI晶片的方法。 本发明的另一个目的是提供一种半导体器件,其还包括用作高电压区域的体型型MISFET及其制造方法,而不需要使用复杂的工艺并增加半导体芯片的尺寸。 制造半导体器件的方法包括选择性地外延生长单晶Si层并连续进行外延生长,而不会使基板温度在生长至室温期间增加甚至一次。 然后将外延生长的表面蚀刻并平坦化。 然后将衬底温度冷却至室温。

    DATA STORAGE DEVICE AND POWER-SAVING CONTROL METHOD FOR DATA STORAGE DEVICE
    3.
    发明申请
    DATA STORAGE DEVICE AND POWER-SAVING CONTROL METHOD FOR DATA STORAGE DEVICE 审中-公开
    数据存储设备和数据存储设备的省电控制方法

    公开(公告)号:US20100169687A1

    公开(公告)日:2010-07-01

    申请号:US12543019

    申请日:2009-08-18

    申请人: Yoshinobu Kimura

    发明人: Yoshinobu Kimura

    IPC分类号: G06F1/32 G06F1/04 G06F12/00

    摘要: A data storage device includes a first nonvolatile memory, a second volatile memory that temporarily stores therein data to be transferred between a host device and the first memory, a first control unit that controls the second memory, a second control unit that controls data transfer between the first control unit and the first memory, a third control unit that controls data transfer between the host device and the first control unit, and a clock stop unit that stops a clock signal supplied to the first to third control units in conjunction with a power consumption control of the third control unit to perform a power saving control.

    摘要翻译: 数据存储装置包括第一非易失性存储器,暂时存储要在主机设备和第一存储器之间传送的数据的第二易失性存储器,控制第二存储器的第一控制单元,控制第二存储器的第二控制单元, 第一控制单元和第一存储器,控制主机设备和第一控制单元之间的数据传输的第三控制单元,以及停止提供给第一至第三控制单元的时钟信号的时钟停止单元, 第三控制单元的消耗控制进行省电控制。

    Oxygen concentrating apparatus
    7.
    发明授权
    Oxygen concentrating apparatus 有权
    氧气浓缩装置

    公开(公告)号:US07491264B2

    公开(公告)日:2009-02-17

    申请号:US10582879

    申请日:2005-02-15

    IPC分类号: C01B13/02 B01D53/04

    摘要: An oxygen concentrating apparatus (10) has an oxygen concentrating unit (12), a compressor (26) for supplying compressed air to the oxygen concentrating unit (12) and a compressor housing (28) for accommodating the compressor (26). The compressor housing (28) includes a plurality of air inlet ports (28a) for introducing the air into the compressor housing (28) and an air outlet opening (28b) for discharging the air from the compressor housing (28). A cooling fan (30) is mounted on the compressor housing (28) at the air outlet opening (28b) for drawing the air from the compressor housing (28). The air inlet ports (28a) are disposed adjacent to the side wall of the compressor (26) to direct the air flow induced by the cooling fan perpendicularly to the side wall of the compressor (26). The capacity of the cooling fan (30) and the diameter of the air inlet ports (28a) are selected to ensure the velocity of the air flow through the air inlet ports (28a) is equal to or lower than 15 m/sec.

    摘要翻译: 氧浓缩装置(10)具有氧浓缩装置(12),用于向氧浓缩装置(12)供给压缩空气的压缩机(26)和用于容纳压缩机(26)的压缩机壳体(28)。 压缩机壳体(28)包括用于将空气引入压缩机壳体(28)的多个空气入口(28a)和用于从压缩机壳体(28)排出空气的空气出口开口(28b)。 在空气出口开口(28b)处的压缩机壳体(28)上安装有用于从压缩机壳体(28)抽出空气的冷却风扇(30)。 空气入口(28a)邻近压缩机(26)的侧壁设置,以引导由冷却风扇引起的空气流与压缩机(26)的侧壁垂直。 选择冷却风扇(30)的容积和空气入口(28a)的直径以确保通过空气入口(28a)的空气流的速度等于或低于15m / sec。

    Semiconductor device and manufacturing method of the same
    9.
    发明授权
    Semiconductor device and manufacturing method of the same 失效
    半导体器件及其制造方法相同

    公开(公告)号:US07436046B2

    公开(公告)日:2008-10-14

    申请号:US11242961

    申请日:2005-10-05

    IPC分类号: H01L31/117

    摘要: Provided is a technology capable of suppressing a reduction in electron mobility in a channel region formed in a strained silicon layer. A p type strained silicon layer is formed over a p type silicon-germanium layer formed over a semiconductor substrate. The p type strained layer has a thickness adjusted to be thicker than the critical film thickness at which no misfit dislocation occurs. Accordingly, misfit dislocations occur in the vicinity of the interface between the p type strained silicon layer and p type silicon-germanium layer. At a position which is below the end of a gate electrode and at which misfit dislocations occur, the impurity concentration of the n type strained silicon layer and n type silicon-germanium layer is 1×1019 cm−3 or less.

    摘要翻译: 提供了能够抑制形成在应变硅层中的沟道区域中的电子迁移率降低的技术。 在半导体衬底上形成的p型硅 - 锗层上形成p型应变硅层。 p型应变层的厚度被调整为比没有失配位错发生的临界膜厚度更厚。 因此,在p型应变硅层和p型硅 - 锗层之间的界面附近发生失配位错。 在位于栅电极末端并发生失配位错的位置处,n型应变硅层和n型硅 - 锗层的杂质浓度为1×10 19 cm -3, -3以下。