发明授权
- 专利标题: Method for patterning ceramic layers
- 专利标题(中): 图案化陶瓷层的方法
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申请号: US10425461申请日: 2003-04-29
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公开(公告)号: US06953722B2公开(公告)日: 2005-10-11
- 发明人: Harald Seidl , Martin Gutsche , Thomas Hecht , Stefan Jakschik , Stephan Kudelka , Uwe Schröder , Matthias Schmeide
- 申请人: Harald Seidl , Martin Gutsche , Thomas Hecht , Stefan Jakschik , Stephan Kudelka , Uwe Schröder , Matthias Schmeide
- 申请人地址: DE Munich
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Munich
- 代理商 Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- 优先权: DE10219123 20020429
- 主分类号: H01L21/311
- IPC分类号: H01L21/311 ; H01L21/8242
摘要:
In a method for forming patterned ceramic layers, a ceramic material is deposited on a substrate and is subsequently densified by heat treatment, for example. In this case, the initially amorphous material is converted into a crystalline or polycrystalline form. In order that the now crystalline material can be removed again from the substrate, imperfections are produced in the ceramic material, for example by ion implantation. As a result, the etching medium can more easily attack the ceramic material, so that the latter can be removed with a higher etching rate. Through inclined implantation, the method can be performed in a self-aligning manner and the ceramic material can be removed on one side, by way of example, in trenches or deep trench capacitors.
公开/授权文献
- US20040029343A1 Method for patterning ceramic layers 公开/授权日:2004-02-12
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