摘要:
The present invention relates to a system and method of supplying and repaying loaned funds provided to an employee participating in a contribution based Employee Stock Option Plan. In particular, the present invention relates to a method and system for enabling an employee to contribute more funds into his/her Employee Stock Option Plan in order to benefit from employer discounted stock price by offering a line of credit up to the vested contribution and benefit amount for the employee to originate against.
摘要:
The invention relates to a method for producing an electrochemical cell, in particular a secondary battery or a double-layer capacitor, in which a cell vessel containing at least one porous cell component is filled with a flowable electrolyte. It is based on the object of providing a method involving simpler equipment that reacts to the fluctuating free volume with an adapted filling amount of electrolyte in the interests of optimum filling.This object is achieved by providing that, in a first filling step, an excess amount of electrolyte is introduced, in which the porous cell component is completely immersed, that the electrolyte introduced is subjected to a force that drives out of the cell vessel the part of the electrolyte that is not located in the pores of the porous component and that, in a second filling step, an added amount of electrolyte is introduced.
摘要:
Beverage dispensing apparatus, systems, and related methods are provided that have a recirculation loop to cool fluids in a dispensing tube bundle that delivers beverage fluids to a beverage dispensing assembly. A beverage dispensing apparatus includes an adjustable bypass manifold having an adjustable flow restriction that is configurable to enable the use of the beverage dispensing apparatus with different chilled soda recirculation systems. The adjustable bypass manifold includes ports for connection to the recirculation loop and ports for connection to a soda recirculation system.
摘要:
The invention relates to a distribution system (1) for distributing a fluid (15) into a container (27) from a fluid inlet (26) of the container (27). Distribution system (1) comprises one or more guide plates that form a guide section (2) and a distribution section (3) that adjoins the guide section (2). Distribution section (3) has regions (4, 5) with openings (8, 9) for allowing fluid (17) to pass through. The invention also relates to a heat exchanger device (100) that has a container (27) with a fluid inlet (26), with at least one heat exchanger block (28) that is arranged in the container (27). A distribution system (101) according to the invention is arranged in the container (27) above the heat exchanger block (28).
摘要:
A reflux condenser and a method for conducting away liquid from the lower region of reflux passages, is disclosed. The reflux condenser has at least one heat exchanger block which has reflux passages and refrigerant passages, and a pressure container which encloses the heat exchanger block at the top and laterally. The reflux passages communicate at their lower end with a header which is arranged below the heat exchanger block and has a phase-separating device.
摘要:
A method of evaporating a process stream is disclosed. In an embodiment, a process stream to be cooled is provided to a heat exchanger. A process stream to be evaporated is provided to the heat exchanger. A gas and/or a liquid is admixed with the process stream to be evaporated only when an amount of gas generated during evaporation of the process stream cannot entrain a liquid portion of the process stream to be evaporated. A gas is generated by the admixing.
摘要:
The invention refers to a selective deposition method. A substrate comprising at least one structured surface is provided. The structured surface comprises a first area and a second area. The first area is selectively passivated regarding reactants of a first deposition technique and the second area is activated regarding the reactants the first deposition technique. A passivation layer on the second area is deposited via the first deposition technique. The passivation layer is inert regarding a precursors selected from a group of oxidizing reactants. A layer is deposited in the second area using a second atomic layer deposition technique as second deposition technique using the precursors selected form the group of oxidizing reactants.
摘要:
The present invention relates to a method of fabricating a capacitor in a semiconductor substrate. The capacitor is fabricated such that the capacitor comprises: a trench inside a substrate, the trench having a lower region and an upper region, wherein the trench's diameters in the lower region is larger than in the upper region; a first electrode; a dielectric layer on top of the first electrode; a conductive layer on top of the electric layer, the conductive layer forming a second electrode of the capacitor; and a plug forming a closed cavity inside the lower region.
摘要:
The present invention provides a coating process for patterned substrate surfaces, in which a substrate (101) is provided, the substrate having a surface (105) which is patterned in a substrate patterning region (102) and has one or more trenches (106) that are to be filled to a predetermined filling height (205), a catalyst layer (201) is introduced into the trenches (106) that are to be filled, a reaction layer (202) is deposited catalytically in the trenches (106) that are to be filled, the catalytically deposited reaction layer (202) is densified in the trenches (106) that are to be filled, and the introduction of the catalyst layer (201) and the catalytic deposition of the reaction layer (202) are repeated until the trenches (106) that are to be filled have been filled to the predetermined filling height (205).
摘要:
On a substrate surface, which has been patterned in the form of a relief, of a substrate, typically of a semiconductor wafer, a deposition process is used to provide a covering layer on process surfaces which are vertical or inclined with respect to the substrate surface. The covering layer is patterned in a direction which is vertical with respect to the substrate surface by limiting a process quantity of at least one precursor material and/or by temporarily limiting the deposition process, and is formed as a functional layer or mask for subsequent process steps.