发明授权
- 专利标题: Method of inspecting semiconductor integrated circuit which can quickly measure a cubic body
- 专利标题(中): 检查能快速测量立方体的半导体集成电路的方法
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申请号: US10107824申请日: 2002-03-28
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公开(公告)号: US06954274B2公开(公告)日: 2005-10-11
- 发明人: Yoshihiro Sasaki , Masahiko Nagao
- 申请人: Yoshihiro Sasaki , Masahiko Nagao
- 申请人地址: JP Kanagawa
- 专利权人: NEC Electronics Corporation
- 当前专利权人: NEC Electronics Corporation
- 当前专利权人地址: JP Kanagawa
- 代理机构: Foley & Lardner LLP
- 优先权: JP2001/098739 20010330
- 主分类号: G01B11/02
- IPC分类号: G01B11/02 ; G01B11/24 ; G01N21/89 ; G01N21/956 ; H01L23/12
摘要:
A semiconductor integrated circuit inspecting apparatus inspecting a terminal provided on a mount surface of a semiconductor integrated circuit includes a light emitter, a photographing unit and an inspector. The light emitter emits a linear light obliquely to the mount surface. The photographing unit photographs the mount surface to which the light is emitted to output a photograph signal. The inspector inspects the terminal in accordance with the photograph signal. The photographing unit has N (N is a positive integer) photographing elements. The photograph signal is outputted respectively only from M (M is a positive integer smaller than the N) photographing elements of the N photographing elements.
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