发明授权
- 专利标题： Landing pad for use as a contact to a conductive spacer
- 专利标题（中）： 用作与导电间隔物接触的着陆垫
-
申请号： US10693067申请日： 2003-10-23
-
公开(公告)号： US06960803B2公开(公告)日： 2005-11-01
- 发明人: Dana Lee , Wen-Juei Lu , Felix Ying-Kit Tsui
- 申请人： Dana Lee , Wen-Juei Lu , Felix Ying-Kit Tsui
- 申请人地址： US CA Sunnyvale
- 专利权人： Silicon Storage Technology, Inc.
- 当前专利权人： Silicon Storage Technology, Inc.
- 当前专利权人地址： US CA Sunnyvale
- 代理机构： DLA Piper Rudnick Gray Cary US LLP
- 代理商 Ronald L. Yin
- 主分类号： H01L21/336
- IPC分类号： H01L21/336 ; H01L21/768 ; H01L29/76
摘要：
A landing pad for use as a contact to a conductive spacer adjacent a structure in a semiconductor device comprises two islands, each of which is substantially rectangularly shaped and is spaced apart from one another and from the structure. Conductive spacers are adjacent to each island and overlapping each other and overlapping with the conductive spacer adjacent to the structure. The contact to the landing pad is on the conductive spacers adjacent to the islands and spaced apart from the structure.
公开/授权文献
- US20050090063A1 Landing pad for use as a contact to a conductive spacer 公开/授权日：2005-04-28
信息查询
IPC分类:
