Invention Grant
- Patent Title: Multi-layer conductive memory device
- Patent Title (中): 多层导电存储器件
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Application No.: US10605757Application Date: 2003-10-23
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Publication No.: US06965137B2Publication Date: 2005-11-15
- Inventor: Wayne Kinney , Steven W. Longcor , Darrell Rinerson , Steve Kuo-Ren Hsia
- Applicant: Wayne Kinney , Steven W. Longcor , Darrell Rinerson , Steve Kuo-Ren Hsia
- Assignee: Unity Semiconductor Corporation
- Current Assignee: Unity Semiconductor Corporation
- Agent Morgan Malino
- Main IPC: G11C11/56
- IPC: G11C11/56 ; G11C13/00 ; H01L27/24 ; H01L31/062

Abstract:
A multilayered conductive memory device capable of storing information individually or as part of an array of memory devices is provided. Boundary control issues at the interface between layers of the device due to the use of incompatible materials can be avoided by intentionally doping the conductive metal oxide layers that are comprised of substantially similar materials. Methods of manufacture are also provided herein.
Public/Granted literature
- US20040159867A1 MULTI-LAYER CONDUCTIVE MEMORY DEVICE Public/Granted day:2004-08-19
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