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公开(公告)号:US20110315943A1
公开(公告)日:2011-12-29
申请号:US13225190
申请日:2011-09-02
申请人: DARRELL RINERSON , JONATHAN BORNSTEIN , DAVID HANSEN , ROBIN CHEUNG , STEVEN W. LONGCOR , RENE MEYER , LAWRENCE SCHLOSS
发明人: DARRELL RINERSON , JONATHAN BORNSTEIN , DAVID HANSEN , ROBIN CHEUNG , STEVEN W. LONGCOR , RENE MEYER , LAWRENCE SCHLOSS
CPC分类号: F01D17/26 , F04D29/563 , H01L21/02565 , H01L27/0688 , H01L27/2409 , H01L27/2418 , H01L27/2472 , H01L27/2481 , H01L45/08 , H01L45/12 , H01L45/1233 , H01L45/147 , H01L45/1666
摘要: Memory cell formation using ion implant isolated conductive metal oxide is disclosed, including forming a bottom electrode below un-etched conductive metal oxide layer(s), forming the un-etched conductive metal oxide layer(s) including depositing at least one layer of a conductive metal oxide (CMO) material (e.g., PrCaMnOx, LaSrCoOx, LaNiOx, etc.) over the bottom electrode. At least one portion of the layer of CMO is configured to act as a memory element without etching, and performing ion implantation on portions of the layer(s) of CMO to create insulating metal oxide (IMO) regions in the layer(s) of CMO. The IMO regions are positioned adjacent to electrically conductive CMO regions in the un-etched layer(s) of CMO and the electrically conductive CMO regions are disposed above and in contact with the bottom electrode and form memory elements operative to store non-volatile data as a plurality of conductivity profiles (e.g., resistive states indicative of stored data).
摘要翻译: 公开了使用离子注入隔离的导电金属氧化物的存储单元形成,包括在未蚀刻的导电金属氧化物层之下形成底部电极,形成未蚀刻的导电金属氧化物层,包括沉积至少一层 导电金属氧化物(CMO)材料(例如PrCaMnOx,LaSrCoOx,LaNiOx等)。 CMO层的至少一部分被配置为用作存储元件而不进行蚀刻,并且在CMO的层的部分上执行离子注入以在层的一个或多个层中形成绝缘金属氧化物(IMO)区域 CMO。 IMO区域定位在CMO的未蚀刻层中的导电CMO区域附近,并且导电CMO区域设置在底部电极的上方并与底部电极接触并形成用于存储非易失性数据的存储元件 多个电导率分布(例如,表示存储的数据的电阻状态)。
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公开(公告)号:US08062942B2
公开(公告)日:2011-11-22
申请号:US12215958
申请日:2008-06-30
申请人: Darrell Rinerson , Wayne Kinney , Edmond Ward , Steve Kuo-Ren Hsia , Steven W. Longcor , Christophe J. Chevallier , John E. Sanchez, Jr. , Philip Swab
发明人: Darrell Rinerson , Wayne Kinney , Edmond Ward , Steve Kuo-Ren Hsia , Steven W. Longcor , Christophe J. Chevallier , John E. Sanchez, Jr. , Philip Swab
IPC分类号: H01L21/00
CPC分类号: H01L27/2463 , G11C11/16 , G11C11/5685 , G11C13/0002 , G11C13/0007 , G11C13/004 , G11C13/0069 , G11C13/0097 , G11C2013/009 , G11C2213/15 , G11C2213/31 , G11C2213/32 , G11C2213/71 , G11C2213/77 , G11C2213/79 , H01L27/24 , H01L27/2481 , H01L45/04 , H01L45/06 , H01L45/1233 , H01L45/1253 , H01L45/146 , H01L45/147 , H01L45/1633 , H01L45/1658
摘要: A treated conductive element is provided. A conductive element can be treated by depositing either a reactive metal or a very thin layer of material on the conductive element. The reactive metal (or very thin layer of material) would typically be sandwiched between the conductive element and an electrode. The structure additionally exhibits non-linear IV characteristics, which can be favorable in certain arrays.
摘要翻译: 提供经处理的导电元件。 可以通过在导电元件上沉积反应性金属或非常薄的材料层来处理导电元件。 反应性金属(或非常薄的材料层)通常将夹在导电元件和电极之间。 该结构还具有非线性IV特性,这在某些阵列中是有利的。
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公开(公告)号:US07528405B2
公开(公告)日:2009-05-05
申请号:US11714555
申请日:2007-03-05
IPC分类号: H01L29/06
CPC分类号: H01L27/101 , G11C11/5685 , G11C13/0007 , G11C2213/31 , G11C2213/77 , G11C2213/79 , H01L27/11502 , H01L27/11507 , H01L27/2436 , H01L27/2481 , H01L45/04 , H01L45/1233 , H01L45/147 , H01L45/1625 , H01L45/1641 , H01L45/1675
摘要: A conductive memory stack is provided. The memory stack includes a bottom electrode, a top electrode and a multi-resistive state element. The multi-resistive state element is sandwiched between the electrodes such that the top face of the bottom electrode is in contact with the multi-resistive state element's bottom face and the bottom face of the top electrode is in contact with the multi-resistive state element's top face. The bottom electrode, the top electrode and the multi-resistive state element all have sides that are adjacent to their faces. Furthermore, the sides are at least partially covered by a sidewall layer.
摘要翻译: 提供导电存储器堆叠。 存储器堆叠包括底部电极,顶部电极和多电阻状态元件。 多电阻状态元件被夹在电极之间,使得底部电极的顶面与多电阻状态元件的底面接触,并且顶部电极的底面与多电阻状态元件的底面接触 顶面。 底部电极,顶部电极和多电阻状态元件都具有与其表面相邻的侧面。 此外,侧面至少部分地被侧壁层覆盖。
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公开(公告)号:US20090045390A1
公开(公告)日:2009-02-19
申请号:US12286723
申请日:2008-10-01
申请人: Darrel Rinerson , Wayne Kinney , Edmond R. Ward , Steve Kuo-Ren Hsia , Steven W. Longcor , Christophe J. Chevallier , John Sanchez , Philip F. S. Swab
发明人: Darrel Rinerson , Wayne Kinney , Edmond R. Ward , Steve Kuo-Ren Hsia , Steven W. Longcor , Christophe J. Chevallier , John Sanchez , Philip F. S. Swab
IPC分类号: H01L45/00
CPC分类号: H01L27/2463 , G11C11/16 , G11C11/5685 , G11C13/0002 , G11C13/0007 , G11C13/004 , G11C13/0069 , G11C13/0097 , G11C2013/009 , G11C2213/15 , G11C2213/31 , G11C2213/32 , G11C2213/71 , G11C2213/77 , G11C2213/79 , H01L27/24 , H01L27/2481 , H01L45/04 , H01L45/06 , H01L45/1233 , H01L45/1253 , H01L45/146 , H01L45/147 , H01L45/1633 , H01L45/1658
摘要: A memory cell including conductive oxide electrodes is disclosed. The memory cell includes a memory element operative to store data as a plurality of resistive states. The memory element includes a layer of a conductive metal oxide (CMO) (e.g., a perovskite) in contact with an electrode that may comprise one or more layers of material. At least one of those layers of material can be a conductive oxide (e.g., a perovskite such as LaSrCoO3—LSCoO or LaNiO3—LNO) that is in contact with the CMO. The conductive oxide layer can be selected as a seed layer operative to provide a good lattice match with and/or a lower crystallization temperature for the CMO. The conductive oxide layer may also be in contact with a metal layer (e.g., Pt). The memory cell additionally exhibits non-linear IV characteristics, which can be favorable in certain arrays, such as non-volatile two-terminal cross-point memory arrays.
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公开(公告)号:US07326979B2
公开(公告)日:2008-02-05
申请号:US10665882
申请日:2003-09-19
申请人: Darrell Rinerson , Wayne Kinney , John E. Sanchez, Jr. , Steven W. Longcor , Steve Kuo-Ren Hsia , Edmond Ward , Christophe Chevallier
发明人: Darrell Rinerson , Wayne Kinney , John E. Sanchez, Jr. , Steven W. Longcor , Steve Kuo-Ren Hsia , Edmond Ward , Christophe Chevallier
IPC分类号: H01L29/76
CPC分类号: G11C13/003 , G11C11/5685 , G11C13/0007 , G11C2213/31 , G11C2213/72 , G11C2213/74 , G11C2213/76 , H01L27/2418 , H01L27/2436 , H01L45/04 , H01L45/1233 , H01L45/1253 , H01L45/147 , H01L45/165
摘要: A multi-resistive state element that uses a treated interface is provided. A memory plug includes at least two electrodes that sandwich a multi-resistive state element. Using different treatments on both electrode/multi-resistive state element interfaces improves the memory properties of the entire memory device.
摘要翻译: 提供了使用处理接口的多电阻状态元素。 存储插头包括夹着多电阻状态元件的至少两个电极。 在电极/多电阻状态元件接口上使用不同的处理可改善整个存储器件的存储器特性。
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公开(公告)号:US07186569B2
公开(公告)日:2007-03-06
申请号:US10605977
申请日:2003-11-11
申请人: Darrell Rinerson , Christophe Chevallier , Steve Kuo-Ren Hsia , Wayne Kinney , Steven W. Longcor , Emond Ward
发明人: Darrell Rinerson , Christophe Chevallier , Steve Kuo-Ren Hsia , Wayne Kinney , Steven W. Longcor , Emond Ward
IPC分类号: H01L21/00
CPC分类号: H01L27/101 , G11C11/5685 , G11C13/0007 , G11C2213/31 , G11C2213/77 , G11C2213/79 , H01L27/11502 , H01L27/11507 , H01L27/2436 , H01L27/2481 , H01L45/04 , H01L45/1233 , H01L45/147 , H01L45/1625 , H01L45/1641 , H01L45/1675
摘要: A conductive memory stack is provided. The memory stack includes a bottom electrode, a top electrode and a multi-resistive state element. The multi-resistive state element is sandwiched between the electrodes such that the top face of the bottom electrode is in contact with the multi-resistive state element's bottom face and the bottom face of the top electrode is in contact with the multi-resistive state element's top face. The bottom electrode, the top electrode and the multi-resistive state element all have sides that are adjacent to their faces. Furthermore, the sides are at least partially covered by a sidewall layer.
摘要翻译: 提供导电存储器堆叠。 存储器堆叠包括底部电极,顶部电极和多电阻状态元件。 多电阻状态元件被夹在电极之间,使得底部电极的顶面与多电阻状态元件的底面接触,并且顶部电极的底面与多电阻状态元件的底面接触 顶面。 底部电极,顶部电极和多电阻状态元件都具有与其表面相邻的侧面。 此外,侧面至少部分地被侧壁层覆盖。
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公开(公告)号:US07057914B2
公开(公告)日:2006-06-06
申请号:US10612776
申请日:2003-07-01
申请人: Darrell Rinerson , Christophe J. Chevallier , Steven W. Longcor , Wayne Kinney , Edmond R. Ward , Steve Kuo-Ren Hsia
发明人: Darrell Rinerson , Christophe J. Chevallier , Steven W. Longcor , Wayne Kinney , Edmond R. Ward , Steve Kuo-Ren Hsia
IPC分类号: G11C7/00
CPC分类号: G11C13/0007 , G11C11/5685 , G11C2213/31 , G11C2213/77
摘要: Cross point array with fast access time. A cross point array is driven by drivers on a semiconductor substrate. The drivers for either a single-layer cross point array or for the bottom layer of a stacked cross point array can be positioned to improve access time. Specifically, if the x-direction drivers are positioned in the middle of the x-direction conductive array lines and the y-direction drivers are positioned in the middle of the y-direction conductive array lines, the access time will be improved.
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公开(公告)号:US07042035B2
公开(公告)日:2006-05-09
申请号:US10765406
申请日:2004-01-26
申请人: Darrell Rinerson , Steven W. Longcor , Steve Kuo-Ren Hsia , Wayne Kinney , Edmond R. Ward , Christophe J. Chevallier
发明人: Darrell Rinerson , Steven W. Longcor , Steve Kuo-Ren Hsia , Wayne Kinney , Edmond R. Ward , Christophe J. Chevallier
IPC分类号: H01L31/113 , H01L31/062
CPC分类号: H01L27/2436 , G11C11/5685 , G11C13/0007 , G11C13/003 , G11C2213/31 , G11C2213/72 , G11C2213/74 , G11C2213/76 , G11C2213/77 , H01L27/2418 , H01L45/04 , H01L45/1233 , H01L45/1253 , H01L45/147 , H01L45/165
摘要: A memory array with components that can withstand high temperature fabrication is provided. Some memory materials require high temperature process steps in order to achieve desired properties. During fabrication, a memory material is deposited on structures that may include metal lines and barrier layers. Such structures are then exposed to the high temperature processing steps and should be resistant to such temperatures.
摘要翻译: 提供了具有可承受高温制造的部件的存储器阵列。 一些记忆材料需要高温工艺步骤才能达到所需的性能。 在制造期间,将记忆材料沉积在可以包括金属线和阻挡层的结构上。 然后将这种结构暴露于高温加工步骤,并且应该能够抵抗这种温度。
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公开(公告)号:US06965137B2
公开(公告)日:2005-11-15
申请号:US10605757
申请日:2003-10-23
IPC分类号: G11C11/56 , G11C13/00 , H01L27/24 , H01L31/062
CPC分类号: G11C13/003 , G11C11/5685 , G11C13/0007 , G11C2213/31 , G11C2213/72 , G11C2213/74 , G11C2213/76 , H01L27/2418 , H01L27/2436 , H01L45/04 , H01L45/1233 , H01L45/1253 , H01L45/147 , H01L45/165
摘要: A multilayered conductive memory device capable of storing information individually or as part of an array of memory devices is provided. Boundary control issues at the interface between layers of the device due to the use of incompatible materials can be avoided by intentionally doping the conductive metal oxide layers that are comprised of substantially similar materials. Methods of manufacture are also provided herein.
摘要翻译: 提供能够单独存储信息或作为存储器件阵列的一部分的多层导电存储器件。 通过有意地掺杂由基本相似的材料构成的导电金属氧化物层,可以避免由于使用不相容的材料而在器件层之间的界面处的边界控制问题。 本文还提供了制造方法。
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公开(公告)号:US06909632B2
公开(公告)日:2005-06-21
申请号:US10921037
申请日:2004-08-17
申请人: Darrell Rinerson , Christophe J. Chevallier , Steven W. Longcor , Edmond R. Ward , Wayne Kinney , Steve Kuo-Ren Hsia
发明人: Darrell Rinerson , Christophe J. Chevallier , Steven W. Longcor , Edmond R. Ward , Wayne Kinney , Steve Kuo-Ren Hsia
CPC分类号: G11C13/0007 , G11C11/5685 , G11C2213/31 , G11C2213/77
摘要: Multiple modes of operation in a cross point array. The invention is a cross point array that uses a read voltage across a conductive array line pair during a read mode. The read voltage produces a read current that is indicative of a first program state when the read current is at a first level and indicative of a second program state when the read current is at a second level. The read current is ineffective to produce a change in program state. A first voltage pulse is used during a first write mode if a change from a second program state to a first program state is desired. A second voltage pulse is used during a second write mode if a change from the first program state to the second program state is desired.
摘要翻译: 交叉点阵列中的多种操作模式。 本发明是在读取模式期间使用导电阵列线对上的读取电压的交叉点阵列。 当读取电流处于第一电平并且当读取电流处于第二电平时,读取电压产生指示第一编程状态的读取电流,并且指示第二编程状态。 读取电流无效,导致程序状态的变化。 如果希望从第二编程状态改变到第一编程状态,则在第一写入模式期间使用第一电压脉冲。 如果希望从第一编程状态改变到第二编程状态,则在第二写入模式期间使用第二电压脉冲。
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