Invention Grant
- Patent Title: Method of transferring a device, a method of producing a device holding substrate, and a device holding substrate
- Patent Title (中): 传送装置的方法，制造装置保持基板的方法以及装置保持基板
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Application No.: US11059865Application Date: 2005-02-17
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Publication No.: US06969624B2Publication Date: 2005-11-29
- Inventor: Toshiaki Iwafuchi , Yoshiyuki Yanagisawa , Toyoharu Oohata
- Applicant: Toshiaki Iwafuchi , Yoshiyuki Yanagisawa , Toyoharu Oohata
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Bell, Boyd & Lloyd LLC
- Priority: JPP2000-380944 20001214
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/683 ; H01L21/762 ; H01L25/075 ; H01L27/15 ; H01L33/00 ; H01L33/20 ; H01L33/24 ; H01L33/32
Abstract:
The interface between a first substrate and light-emitting diodes formed on the first substrate is selectively irradiated with an energy beam and transmits the energy beam through the first substrate, thereby selectively releasing the light-emitting diodes. The light-emitting diodes are then transferred onto a device holding layer included on a device holding substrate. Subsequently, the light-emitting diodes are transferred onto a second substrate. The irradiation of the interface with the energy beam enables the devices to be easily released from the first substrate.
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Information query
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