发明授权
- 专利标题: Modular high density connector
- 专利标题(中): 模块化高密度连接器
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申请号: US10816350申请日: 2004-03-31
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公开(公告)号: US06971929B2公开(公告)日: 2005-12-06
- 发明人: Sohrab Safai , Carl Rodney Bunke , Chris Harold McDonald , Rene Augusto Mosquera
- 申请人: Sohrab Safai , Carl Rodney Bunke , Chris Harold McDonald , Rene Augusto Mosquera
- 申请人地址: US DE Wilmington
- 专利权人: ITT Manufacturing Enterprises, Inc.
- 当前专利权人: ITT Manufacturing Enterprises, Inc.
- 当前专利权人地址: US DE Wilmington
- 代理商 Peter Van Winkle
- 主分类号: H01R12/22
- IPC分类号: H01R12/22 ; H01R12/00 ; H01R12/16 ; H01R12/32 ; H01R13/22 ; H01R13/24 ; H01R13/40 ; H01R13/514 ; H01R13/518 ; H01R13/627
摘要:
A connector includes sheet metal contacts (40, 42) with termination ends (60, 62) for terminating to wires and with mating ends (70, 72) for mating to other contact devices such as circuit board pads. Each terminating end includes a wide groove part (90) with a groove bottom (94) that receives the wire insulation and with a pair of wide groove part wings (96, 98) that are crimped around the insulation. Each termination end also includes a narrow groove part (100) for receiving a bared conductor of the wire, the narrow groove part having a bottom (104) that is offset from the wide groove part bottom (94), and the narrow groove part having a pair of narrow groove part wings (106, 108) that are crimped around the wire conductor.
公开/授权文献
- US20050221639A1 Modular high density connector 公开/授权日:2005-10-06
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