发明授权
US06976906B2 Apparatus for reducing compressed dry air usage during chemical mechanical planarization
失效
用于在化学机械平面化期间减少压缩干燥空气使用的装置
- 专利标题： Apparatus for reducing compressed dry air usage during chemical mechanical planarization
- 专利标题（中）： 用于在化学机械平面化期间减少压缩干燥空气使用的装置
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申请号： US10681719申请日： 2003-10-07
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公开(公告)号： US06976906B2公开(公告)日： 2005-12-20
- 发明人: John M. Boyd , David Wei , Yehiel Gotkis
- 申请人： John M. Boyd , David Wei , Yehiel Gotkis
- 申请人地址： US CA Fremont
- 专利权人： Lam Research Corporation
- 当前专利权人： Lam Research Corporation
- 当前专利权人地址： US CA Fremont
- 代理机构： Martine Penilla & Gencarella, LLP
- 主分类号： B24B21/04
- IPC分类号： B24B21/04 ; B24B37/04 ; B24B5/00
摘要：
A chemical mechanical planarization (CMP) system is provided. The system includes a polishing surface and a platen disposed along an underside of the polishing surface. A retaining ring surrounds the platen. The retaining ring includes a lower annular sleeve and an upper annular sleeve moveably disposed over the lower annular sleeve. A method for reducing a consumption of compressed dry air (CDA) during a chemical mechanical planarization (CMP) operation is also described.
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