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    METAL STRIP PRODUCTION BY GRINDING
    2.
    发明公开
    METAL STRIP PRODUCTION BY GRINDING 审中-公开

    公开(公告)号：US20240001504A1

    公开(公告)日：2024-01-04

    申请号：US18254362

    申请日：2021-11-25

    申请人： Berndorf Band GmbH

    发明人： Johannes Günther SIMMEL

    IPC分类号： B24B21/04 ,  B23P15/00 ,  B24B7/12 ,  B21D53/14 ,  B21D1/02

    CPC分类号： B24B21/04 ,  B23P15/00 ,  B24B7/12 ,  B21D53/14 ,  B21D1/02

    摘要： A method for producing a metal belt, in which the metal belt is ground at least on one side over essentially the entire surface. In a first step, a transverse curvature in the direction of the belt width is produced on the metal belt by straightening machining, wherein a first side of the metal belt is convexly shaped and a second side of the metal belt opposite the first side is at least planar or concave in shape, and in a second step, the course of the belt thickness in the direction of the belt width is changed to a uniform course of a value of the belt thickness.

    Method for producing a structure on a surface
    3.
    发明授权
    Method for producing a structure on a surface 有权

    公开(公告)号：US11559824B2

    公开(公告)日：2023-01-24

    申请号：US16865355

    申请日：2020-05-03

    申请人： Hymmen GmbH Maschinen- und Anlagenbau

    发明人： René Pankoke

    IPC分类号： B05D1/02 ,  B05B1/02 ,  B05D3/00 ,  B24B7/19 ,  B24B21/04 ,  B24B53/00 ,  B41M5/00 ,  B44C3/00 ,  B29C59/02 ,  B29C59/16 ,  B24B29/00

    摘要： A method for manufacturing a structure on a surface of a workpiece (1) is disclosed, the method having the following steps: applying a liquid base layer (2) onto the surface of the workpiece (1); spraying on at least one droplet (3) into the not yet congealed base layer (2), wherein the at least one droplet (3) at least partially, preferably completely, penetrates into the base layer (2); fixing the base layer (2); and at least partially removing the at least one droplet (3). Further, a second method having the following steps is disclosed: spraying on at least one droplet (3) onto the surface of the workpiece (1); applying a liquid base layer (2) onto the surface of the workpiece (1), wherein the base layer (2) flows around the at least one droplet (3) and preferably at least partially covers the at least one droplet (3); fixing the base layer (2); at least partially removing the at least one droplet (3). Finally, a device for performing the methods is disclosed.

    SYSTEM FOR POST-PROCESSING OF ENGINEERED-WOOD FENCE PICKETS
    4.
    发明申请
    SYSTEM FOR POST-PROCESSING OF ENGINEERED-WOOD FENCE PICKETS 有权

    公开(公告)号：US20210121912A1

    公开(公告)日：2021-04-29

    申请号：US17084218

    申请日：2020-10-29

    申请人： LOUISIANA-PACIFIC CORPORATION

    发明人： JARROD KEVIN LINE ,  HEIDI TURNER

    IPC分类号： B05D3/12 ,  B24B21/04 ,  B05D1/02 ,  B05D7/06 ,  B05D7/00 ,  B05B16/20

    摘要： A method and system for post-processing of engineered-wood fence pickets or similar fencing components. A post-processing line in the manufacturing factory or facility, or in a post-processing location, includes a special edge-sanding process and apparatus with one or more side sanders to treat the rough edges of the engineered-wood fence picket after sawing. The edge-sanding process produces a smooth side surface on the edges, significantly reduces the number of loose fibers and/or strands, and fills in and/or reduces void spaces. After sanding, the pickets on the belt pass through an apparatus for application of a primer to the processed picket edges. Acutely-angled limited fan sprayers provide complete coverage of the edges with primer at a particular coating thickness required for encapsulation and protection of the fence picket product. The limited fan sprayers may be positioned at varying angles and orientations with respect to the belt and pickets.

    Finishing device
    6.
    发明授权
    Finishing device 有权

    公开(公告)号：US09987717B2

    公开(公告)日：2018-06-05

    申请号：US15051696

    申请日：2016-02-24

    申请人： Supfina Grieshaber GmbH & Co. KG

    发明人： Stephen Coelho

    IPC分类号： B24B33/08 ,  B24B21/00 ,  B24B21/02 ,  B24B21/04 ,  B24B33/04 ,  B24B5/01 ,  B24B5/04 ,  B24B5/42

    CPC分类号： B24B33/08 ,  B24B5/01 ,  B24B5/047 ,  B24B5/42 ,  B24B21/004 ,  B24B21/02 ,  B24B21/04 ,  B24B33/04

    摘要： A finishing device includes a finishing belt, a finishing belt holding device, a first drive configured to rotationally drive a workpiece about a workpiece axis, and a second drive configured to oscillate the workpiece and the finishing belt relative to another along the workpiece axis. The finishing belt holding device has a holding section configured to hold a portion of the finishing belt. The portion has an active area configured to finish a circumferential workpiece surface. The portion extends in a plane which is vertical when referring to the direction of gravity and extends in a horizontal direction when referring to the direction of gravity and when viewing in the running direction of the finishing belt. The finishing device includes a workpiece holding device defining a workpiece holding axis which is vertical when referring to the direction of gravity.

    Polishing apparatus and polishing method
    8.
    发明授权
    Polishing apparatus and polishing method 有权
    抛光设备和抛光方法

    公开(公告)号：US08979615B2

    公开(公告)日：2015-03-17

    申请号：US13308857

    申请日：2011-12-01

    申请人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi ,  Naoki Matsuda ,  Atsushi Yoshida

    发明人： Masaya Seki ,  Tetsuji Togawa ,  Masayuki Nakanishi ,  Naoki Matsuda ,  Atsushi Yoshida

    IPC分类号： B24B21/04 ,  B24B9/06 ,  B24B21/00

    CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/006 ,  B24B21/008 ,  B24B21/20

    摘要： The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.

    摘要翻译： 抛光装置具有能够抛光基板的周边部分以形成直角横截面的抛光单元。 抛光装置包括：保持和旋转衬底的衬底保持器; 支撑抛光带的导辊; 以及抛光头，其具有从上方将研磨带的边缘压靠在基板的周边部分的按压部件。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。 基板保持器包括：保持基板的保持台; 以及支撑台，其整体地支撑基板的周边部分的下表面。 支撑台与保持台一致地旋转。

    Polishing silicon wafers
    9.
    发明授权
    Polishing silicon wafers 有权
    抛光硅片

    公开(公告)号：US06971950B2

    公开(公告)日：2005-12-06

    申请号：US10689678

    申请日：2003-10-22

    申请人： Walter Dudovicz

    发明人： Walter Dudovicz

    IPC分类号： B24B21/04 ,  B24B37/20 ,  B24B37/26 ,  B24D11/06 ,  H01L21/304

    CPC分类号： B24B37/205 ,  B24B21/04 ,  B24B37/26 ,  B24D11/06

    摘要： An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented reinforcing yarns. A further version comprises a spiral-link fabric supporting a woven or non woven layer carrying the polymer layer. The polymer layer may be a double layer, the upper of which is either harder or softer than the lower layer.

    摘要翻译： 用于带式抛光机的环形带包括支撑织物和相对低硬度的聚合物层。 聚合物层形成有排水槽。 支撑织物可以包括非织造或编织材料或具有取向增强纱线的膜。 另一版本包括支撑承载聚合物层的机织或非编织层的螺旋链节织物。 聚合物层可以是双层，其上部比下层更硬或更软。