摘要:
A method for manufacturing a structure on a surface of a workpiece (1) is disclosed, the method having the following steps: applying a liquid base layer (2) onto the surface of the workpiece (1); spraying on at least one droplet (3) into the not yet congealed base layer (2), wherein the at least one droplet (3) at least partially, preferably completely, penetrates into the base layer (2); fixing the base layer (2); and at least partially removing the at least one droplet (3). Further, a second method having the following steps is disclosed: spraying on at least one droplet (3) onto the surface of the workpiece (1); applying a liquid base layer (2) onto the surface of the workpiece (1), wherein the base layer (2) flows around the at least one droplet (3) and preferably at least partially covers the at least one droplet (3); fixing the base layer (2); at least partially removing the at least one droplet (3). Finally, a device for performing the methods is disclosed.
摘要:
A method and system for post-processing of engineered-wood fence pickets or similar fencing components. A post-processing line in the manufacturing factory or facility, or in a post-processing location, includes a special edge-sanding process and apparatus with one or more side sanders to treat the rough edges of the engineered-wood fence picket after sawing. The edge-sanding process produces a smooth side surface on the edges, significantly reduces the number of loose fibers and/or strands, and fills in and/or reduces void spaces. After sanding, the pickets on the belt pass through an apparatus for application of a primer to the processed picket edges. Acutely-angled limited fan sprayers provide complete coverage of the edges with primer at a particular coating thickness required for encapsulation and protection of the fence picket product. The limited fan sprayers may be positioned at varying angles and orientations with respect to the belt and pickets.
摘要:
A finishing device includes a finishing belt, a finishing belt holding device, a first drive configured to rotationally drive a workpiece about a workpiece axis, and a second drive configured to oscillate the workpiece and the finishing belt relative to another along the workpiece axis. The finishing belt holding device has a holding section configured to hold a portion of the finishing belt. The portion has an active area configured to finish a circumferential workpiece surface. The portion extends in a plane which is vertical when referring to the direction of gravity and extends in a horizontal direction when referring to the direction of gravity and when viewing in the running direction of the finishing belt. The finishing device includes a workpiece holding device defining a workpiece holding axis which is vertical when referring to the direction of gravity.
摘要:
A processing element for processing a profile-shaped or flat metallic workpiece, with the processing element designed such that a plurality of similar processing elements can be arranged one behind the other on a supporting device in the longitudinal direction of the supporting device, the supporting device can be driven in a circulating manner and the plurality of processing elements can be guided past the workpiece for surface processing at least approximately linearly by means of the supporting device. A rectangular or block-shaped main body having bearing surfaces for bearing on the supporting device is provided, and oblong ribs protruding outward in a web-like manner are provided on the main body on opposite flat longitudinal sides and overlap the corresponding opposite flat longitudinal sides of the main body on an identically embodied processing element, which is arranged between the ribs.
摘要:
The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.
摘要:
An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented reinforcing yarns. A further version comprises a spiral-link fabric supporting a woven or non woven layer carrying the polymer layer. The polymer layer may be a double layer, the upper of which is either harder or softer than the lower layer.
摘要:
A chemical mechanical polishing apparatus includes a rotating plate on which a substrate received, and a polishing pad which moves across the substrate as it rotates on the plate to polish the substrate. The load of the pad against the substrate, and the rotary speed of the plate, may be varied to control the rate of material removed by the pad.
摘要:
A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid spray bar traverses the length of the frame assembly, a cleaning fluid is sprayed onto the web in order to clean the web between planarization cycles.
摘要:
The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.