Invention Grant
- Patent Title: Process for producing a metal layer on a substrate body, and substrate body having a metal layer
- Patent Title (中): 在基体上制造金属层的方法，以及具有金属层的基体
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Application No.: US10916321Application Date: 2004-08-11
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Publication No.: US06984446B2Publication Date: 2006-01-10
- Inventor: Harald Gundlach , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
- Applicant: Harald Gundlach , Andreas Muller-Hipper , Ewald Simmerlein-Erlbacher
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Darby & Darby
- Priority: DE10145750 20010917
- Main IPC: B32B31/30
- IPC: B32B31/30 ; B32B33/00 ; B29C71/00
Abstract:
Process for producing a metal layer on a substrate body. The process includes applying conductive particles to a surface of the substrate body, so that the conductive particles are fixed to the substrate body, and metallizing the substrate body together with the particles chemically and/or by electrodeposition in a metallization bath so as to form the metal layer.
Public/Granted literature
- US20050052326A1 Process for producing a metal layer on a substrate body, and substrate body having a metal layer Public/Granted day:2005-03-10
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