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公开(公告)号：US20070082127A1
公开(公告)日：2007-04-12
申请号：US11608663
申请日：2006-12-08
CPC分类号： H05K3/046 , H05K3/102 , Y10T428/24917
摘要： Process for producing a structured metal layer on a substrate body, in which either a structured bonding layer is applied to the substrate body, in order for a metal foil or a metal powder to be fixed on this bonding layer, or in which a metal foil or a metal layer is applied to the entire surface of a substrate body made from a plastics material and is pressed onto the substrate body with the aid of a structured, heated ram and fixed by a subsequent setting of the substrate body. The metal layer is structured by mechanical removal of those regions of the metal foil or of the metal powder which are not joined to the adhesive or to the substrate body.
摘要翻译： 或者在基板主体上制造结构化金属层的方法，其中将结构化接合层施加到基板主体上，以将金属箔或金属粉末固定在该接合层上，或者其中金属箔 或者将金属层施加到由塑料材料制成的基板主体的整个表面上，并借助于结构化的加热冲头将其压在基板主体上，并通过基板主体的后续设置来固定。 金属层是通过机械去除金属箔或金属粉末的那些区域而构成的，这些区域不与粘合剂或基底本体接合。
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2.发明申请Process for producing a metal layer on a substrate body, and substrate body having a metal layer 失效在基体上制造金属层的方法，以及具有金属层的基体公开(公告)号：US20050052326A1
公开(公告)日：2005-03-10
申请号：US10916321
申请日：2004-08-11
CPC分类号： H05K3/246 , C23C2/02 , C23C18/1817 , C23C18/1841 , C23C18/1865 , C23C18/1889 , C23C18/2033 , C23C18/208 , C23C18/31 , C25D5/54 , C25D5/56 , H05K3/102 , H05K3/386 , Y10T428/24355 , Y10T428/24893 , Y10T428/24917 , Y10T428/25
摘要： Process for producing a metal layer on a substrate body. The process includes applying conductive particles to a surface of the substrate body, so that the conductive particles are fixed to the substrate body, and metallizing the substrate body together with the particles chemically and/or by electrodeposition in a metallization bath so as to form the metal layer.
摘要翻译： 在基体上制造金属层的方法。 该方法包括将导电颗粒施加到衬底主体的表面上，使得导电颗粒固定到衬底主体，并且通过化学和/或电沉积在金属化浴中将衬底主体与颗粒一起金属化以形成 金属层。
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3.发明申请Process for producing a structured metal layer on a substrate body, and substrate body having a structured metal layer 审中-公开在基体上制造结构化金属层的方法，以及具有结构化金属层的基体公开(公告)号：US20050034995A1
公开(公告)日：2005-02-17
申请号：US10917554
申请日：2004-08-12
CPC分类号： H05K3/046 , H05K3/102 , Y10T428/24917
摘要： Process for producing a structured metal layer on a substrate body, in which either a structured bonding layer is applied to the substrate body, in order for a metal foil or a metal powder to be fixed on this bonding layer, or in which a metal foil or a metal layer is applied to the entire surface of a substrate body made from a plastics material and is pressed onto the substrate body with the aid of a structured, heated ram and fixed by a subsequent setting of the substrate body. The metal layer is structured by mechanical removal of those regions of the metal foil or of the metal powder which are not joined to the adhesive or to the substrate body.
摘要翻译： 或者在基板主体上制造结构化金属层的方法，其中将结构化接合层施加到基板主体上，以将金属箔或金属粉末固定在该接合层上，或者其中金属箔 或者将金属层施加到由塑料材料制成的基板主体的整个表面上，并借助于结构化的加热冲头将其压在基板主体上，并通过基板主体的后续设置来固定。 金属层是通过机械去除金属箔或金属粉末的那些区域而构成的，这些区域不与粘合剂或基底本体接合。
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4.发明授权Process for producing a metal layer on a substrate body, and substrate body having a metal layer 失效在基体上制造金属层的方法，以及具有金属层的基体公开(公告)号：US06984446B2
公开(公告)日：2006-01-10
申请号：US10916321
申请日：2004-08-11
CPC分类号： H05K3/246 , C23C2/02 , C23C18/1817 , C23C18/1841 , C23C18/1865 , C23C18/1889 , C23C18/2033 , C23C18/208 , C23C18/31 , C25D5/54 , C25D5/56 , H05K3/102 , H05K3/386 , Y10T428/24355 , Y10T428/24893 , Y10T428/24917 , Y10T428/25
摘要： Process for producing a metal layer on a substrate body. The process includes applying conductive particles to a surface of the substrate body, so that the conductive particles are fixed to the substrate body, and metallizing the substrate body together with the particles chemically and/or by electrodeposition in a metallization bath so as to form the metal layer.
摘要翻译： 在基体上制造金属层的方法。 该方法包括将导电颗粒施加到衬底主体的表面上，使得导电颗粒固定到衬底主体，并且通过化学和/或电沉积在金属化浴中将衬底主体与颗粒一起金属化以形成 金属层。
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5.发明授权Process for producing a metal structure in foam form, a metal foam, and an arrangement having a carrier substrate and a metal foam 失效用于制造泡沫金属结构的方法，金属泡沫和具有载体基底和金属泡沫的布置公开(公告)号：US07192509B2
公开(公告)日：2007-03-20
申请号：US11062318
申请日：2005-02-18
CPC分类号： C23C18/2086 , C23C18/1644 , C23C18/1653 , C25D5/56 , Y10T428/12063
摘要： Process for producing a metal structure in foam form, including the steps of providing a nonconductive substrate having a foamed structure, applying conductive particles to the substrate, so that the conductive particles are fixed to the entire surface of the substrate, and in particular to each individual pore of the substrate, and introducing the pretreated substrate into an electroplating device, in which a homogenous metal layer is formed on the conductive particles.
摘要翻译： 制造泡沫金属结构的方法，包括以下步骤：提供具有发泡结构的非导电基材，将导电颗粒施加到基材上，使得导电颗粒固定在基材的整个表面上，特别是固定在每个 将该预处理基板导入电镀装置，在该电镀装置中，在导电性粒子上形成均匀的金属层。
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6.发明申请Process for producing a metal structure in foam form, a metal foam, and an arrangement having a carrier substrate and a metal foam 失效用于制造泡沫金属结构的方法，金属泡沫和具有载体基底和金属泡沫的布置公开(公告)号：US20050194259A1
公开(公告)日：2005-09-08
申请号：US11062318
申请日：2005-02-18
CPC分类号： C23C18/2086 , C23C18/1644 , C23C18/1653 , C25D5/56 , Y10T428/12063
摘要： Process for producing a metal structure in foam form, including the steps of providing a nonconductive substrate having a foamed structure, applying conductive particles to the substrate, so that the conductive particles are fixed to the entire surface of the substrate, and in particular to each individual pore of the substrate, and introducing the pretreated substrate into an electroplating device, in which a homogenous metal layer is formed on the conductive particles.
摘要翻译： 制造泡沫金属结构的方法，包括以下步骤：提供具有发泡结构的非导电基材，将导电颗粒施加到基材上，使得导电颗粒固定在基材的整个表面上，特别是固定在每个 将该预处理基板导入电镀装置，在该电镀装置中，在导电性粒子上形成均匀的金属层。
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7.发明申请Electrodeposition device and electrodeposition system for coating structures which have already been made conductive 审中-公开用于已经导电的涂层结构的电沉积装置和电沉积系统公开(公告)号：US20050061661A1
公开(公告)日：2005-03-24
申请号：US10916308
申请日：2004-08-11
CPC分类号： C25D5/18 , C25D7/0614 , C25D7/0657 , H05K1/0393 , H05K3/241
摘要： Electrodeposition device for electrodepositing an electrically conductive layer on a substrate having an electrolyte bath in which an anode device and at least one contact-making unit are arranged, each contact-making unit having a plurality of electrically conductive regions of which at least one is connected cathodically and at least one is connected anodically.
摘要翻译： 电沉积装置，用于在具有阳极装置和至少一个接触制造单元的电解质浴的基底上电沉积导电层，每个接触制备单元具有至少一个连接的多个导电区域 阴极和至少一个阳极连接。
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公开(公告)号：US20050272249A1
公开(公告)日：2005-12-08
申请号：US11137698
申请日：2005-05-24
IPC分类号： H05K3/10 , H05K3/18 , H05K3/24 , H01L21/4763
CPC分类号： G06K19/07749 , H05K3/102 , H05K3/184 , H05K3/246 , H05K2201/0224 , H05K2203/0315
摘要： A method of producing a conductive pattern on a substrate, including the steps of providing a surface of the substrate with a conductive layer, which is formed by providing the surface of the substrate at least partly with conductive particles, by directly using the adhesive power of the surface of the substrate, applying a passivation layer to the conductive layer, the passivation layer being formed as a negative image of the conductive pattern, and forming the conductive pattern in the regions not covered by the passivation layer.
摘要翻译： 一种在基板上制造导电图案的方法，包括以下步骤：通过直接使用导电图案的粘合力，提供基板的表面，该导电层是通过至少部分地提供导电颗粒来提供基板的表面而形成的 衬底的表面，向导电层施加钝化层，钝化层形成为导电图案的负像，并且在未被钝化层覆盖的区域中形成导电图案。
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公开(公告)号：US07451936B2
公开(公告)日：2008-11-18
申请号：US11479295
申请日：2006-06-30
IPC分类号： G06K19/05
CPC分类号： G06K19/07747 , G06K19/07749 , H01L2224/16 , H01L2924/0102
摘要： Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.
摘要翻译： 用于非接触式芯片卡或识别系统的模块，具有第一天线接触条和第二天线接触条，每个具有第一表面和背离第一表面的第二表面;半导体芯片，具有至少两个触点，至少一个 接触接触连接第一天线接触条的第一表面和至少一个另外的触点接触连接第二天线接触条的第一表面和至少一个粘合膜条，其至少部分地覆盖两者的第一表面 所述第一天线接触条和所述第二天线接触条，所述至少一个粘合膜条布置在被所述半导体芯片覆盖的所述第一和第二天线接触条的区域的外侧。
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公开(公告)号：US20060243812A1
公开(公告)日：2006-11-02
申请号：US11479295
申请日：2006-06-30
IPC分类号： G06K19/06
CPC分类号： G06K19/07747 , G06K19/07749 , H01L2224/16 , H01L2924/0102
摘要： Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.
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