发明授权
US06987035B2 Method and apparatus for forming crystallized semiconductor layer, and method for manufacturing semiconductor apparatus
失效
用于形成结晶半导体层的方法和装置,以及半导体装置的制造方法
- 专利标题: Method and apparatus for forming crystallized semiconductor layer, and method for manufacturing semiconductor apparatus
- 专利标题(中): 用于形成结晶半导体层的方法和装置,以及半导体装置的制造方法
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申请号: US10857941申请日: 2004-06-02
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公开(公告)号: US06987035B2公开(公告)日: 2006-01-17
- 发明人: Yoshitaka Yamamoto , Mikihiko Nishitani , Masato Hiramatsu , Masayuki Jyumonji , Yoshinobu Kimura
- 申请人: Yoshitaka Yamamoto , Mikihiko Nishitani , Masato Hiramatsu , Masayuki Jyumonji , Yoshinobu Kimura
- 申请人地址: JP Yokohama
- 专利权人: Advanced LCD Technologies Development Center Co., Ltd.
- 当前专利权人: Advanced LCD Technologies Development Center Co., Ltd.
- 当前专利权人地址: JP Yokohama
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权: JP2003-158136 20030603
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A method for forming a crystallized semiconductor layer includes preparing a non-single-crystal semiconductor layer in which at least one crystal seed is formed, and irradiating with an energy ray the non-single-crystal semiconductor layer having the crystal seed formed therein to allow a crystal to laterally grow from the crystal seed in the non-single-crystal semiconductor layer, irradiation of the energy ray is carried out by positioning to at least a part of the crystal seed an area having a minimum intensity value of the energy ray, the energy ray having a confirmation that an area having a maximum intensity value of the energy ray is continuously reduced to the area having the minimum intensity value in an irradiated surface.
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