- 专利标题: High dielectric constant metal oxide gate dielectrics
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申请号: US10646034申请日: 2003-08-22
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公开(公告)号: US06998357B2公开(公告)日: 2006-02-14
- 发明人: Gang Bai , David B. Fraser , Brian S. Doyle , Peng Cheng , Chunlin Liang
- 申请人: Gang Bai , David B. Fraser , Brian S. Doyle , Peng Cheng , Chunlin Liang
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: H01L21/469
- IPC分类号: H01L21/469
摘要:
A method of forming a dielectric layer suitable for use as the gate dielectric layer of a metal-oxide-semiconductor field effect transistor (MOSFET) includes oxidizing the surface of a silicon substrate, forming a metal layer over the oxidized surface, and reacting the metal with the oxidized surface to form a substantially intrinsic layer of silicon superjacent the substrate, wherein at least a portion of the silicon layer may be an epitaxial silicon layer, and a metal oxide layer superjacent the silicon layer. In a further aspect of the present invention, an integrated circuit includes a plurality of MOSFETs, wherein various ones of the plurality of transistors have metal oxide gate dielectric layers and substantially intrinsic silicon layers subjacent the metal oxide dielectric layers.
公开/授权文献
- US20050087820A1 High dielectric constant metal oxide gate dielectrics 公开/授权日:2005-04-28
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