发明授权
- 专利标题: Method of production of semiconductor package
- 专利标题(中): 半导体封装的生产方法
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申请号: US10693374申请日: 2003-10-24
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公开(公告)号: US07033934B2公开(公告)日: 2006-04-25
- 发明人: Takahiro Iijima , Akio Rokugawa
- 申请人: Takahiro Iijima , Akio Rokugawa
- 申请人地址: JP Nagano
- 专利权人: Shinko Electric Industries Co., Ltd.
- 当前专利权人: Shinko Electric Industries Co., Ltd.
- 当前专利权人地址: JP Nagano
- 代理机构: Paul and Paul
- 优先权: JP2001-341643 20011107
- 主分类号: H01L21/44
- IPC分类号: H01L21/44
摘要:
A semiconductor package of superior high frequency characteristics enabling easy mounting of a large-sized capacitor and thereby enabling fluctuation of the power supply voltage to be suppressed and enabling a reduction of the inductance of the wiring portion connecting the capacitor and a connection terminal, that is, a semiconductor package mounting a capacitor for suppressing fluctuation of a power supply voltage, wherein the capacitor is comprised of, in an attachment hole passing through the board in the thickness direction, a conductor wire to be connected to a connection terminal of a semiconductor chip at one end, a high dielectric constant material covering the conductor wire at a predetermined thickness, and a conductor layer arranged between the outer circumference of the high dielectric constant material and the inner wall of the attachment hole, provided as a coaxial structure having the conductor wire at its center, and a method of production of the same.
公开/授权文献
- US20040238949A1 Semiconductor package and method of production thereof 公开/授权日:2004-12-02