- 专利标题： Semiconductor assembly with conductive rim and method of producing the same
-
申请号： US10737231申请日： 2003-12-15
-
公开(公告)号： US07034393B2公开(公告)日： 2006-04-25
- 发明人: Susan A. Alie , Bruce K. Wachtmann , Michael Judy , David Kneedler
- 申请人： Susan A. Alie , Bruce K. Wachtmann , Michael Judy , David Kneedler
- 申请人地址： US MA Norwood
- 专利权人： Analog Devices, Inc.
- 当前专利权人： Analog Devices, Inc.
- 当前专利权人地址： US MA Norwood
- 代理机构： Bromberg & Sunstein LLP
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/10 ; H01L23/12
摘要：
An apparatus has first and second wafers, and a conductive rim between the first and second wafers. The conductive rim electrically and mechanically connects the first and second wafers. In addition, the conductive rim and second wafer at least in part seal an area on the surface of the first wafer.
公开/授权文献
信息查询
IPC分类:
