公开(公告)号：US07034393B2

公开(公告)日：2006-04-25

申请号：US10737231

申请日：2003-12-15

申请人： Susan A. Alie ,  Bruce K. Wachtmann ,  Michael Judy ,  David Kneedler

发明人： Susan A. Alie ,  Bruce K. Wachtmann ,  Michael Judy ,  David Kneedler

IPC分类号： H01L23/02 ,  H01L23/10 ,  H01L23/12

CPC分类号： B81B7/007 ,  B81C2203/019 ,  H01L2224/16225 ,  Y10S257/924

摘要： An apparatus has first and second wafers, and a conductive rim between the first and second wafers. The conductive rim electrically and mechanically connects the first and second wafers. In addition, the conductive rim and second wafer at least in part seal an area on the surface of the first wafer.

公开(公告)号：US06956274B2

公开(公告)日：2005-10-18

申请号：US10044009

申请日：2002-01-11

申请人： Susan A. Alie ,  Bruce K. Wachtmann ,  David S. Kneedler ,  Scott Limb ,  Kieran Nunan

发明人： Susan A. Alie ,  Bruce K. Wachtmann ,  David S. Kneedler ,  Scott Limb ,  Kieran Nunan

IPC分类号： B81B7/00 ,  H01L27/095

CPC分类号： B81B7/0006

摘要： A metallization stack is provided for use as a contact structure in an integrated MEMS device. The metallization stack comprises a titanium-tungsten adhesion and barrier layer formed with a platinum layer formed on top. The platinum feature is formed by sputter etching the platinum in argon, followed by a wet etch in aqua regia using an oxide hardmask. Alternatively, the titanium-tungsten and platinum layers are deposited sequentially and patterned by a single plasma etch process with a photoresist mask.

摘要翻译： 提供金属化堆叠用作集成MEMS器件中的接触结构。 金属化堆叠包括形成在顶部形成有铂层的钛 - 钨粘合和阻挡层。 铂特征是通过在氩气中溅射蚀刻铂，然后使用氧化物硬掩模在王水中进行湿式蚀刻而形成的。 或者，通过用光致抗蚀剂掩模的单等离子体蚀刻工艺顺序地沉积钛 - 钨和铂层并图案化。

公开(公告)号：US06878626B1

公开(公告)日：2005-04-12

申请号：US10325091

申请日：2002-12-20

申请人： Susan A. Alie ,  Bruce K. Wachtmann ,  David S. Kneedler ,  Scott Limb ,  Kieran Nunan

发明人： Susan A. Alie ,  Bruce K. Wachtmann ,  David S. Kneedler ,  Scott Limb ,  Kieran Nunan

IPC分类号： B81B7/00 ,  H01L21/44

CPC分类号： B81B7/0006

摘要： A metallization stack is provided for use as a contact structure in an integrated MEMS device. The metallization stack includes a titanium-tungsten adhesion and barrier layer formed with a platinum layer formed on top. The platinum feature is formed by sputter etching the platinum in argon, followed by a wet etch in aqua regia using an oxide hardmask. Alternatively, the titanium-tungsten and platinum layers are deposited sequentially and patterned by a single plasma etch process with a photoresist mask.

摘要翻译： 提供金属化堆叠用作集成MEMS器件中的接触结构。 金属化堆叠包括形成在顶部形成有铂层的钛 - 钨粘合和阻挡层。 铂特征是通过在氩气中溅射蚀刻铂，然后使用氧化物硬掩模在王水中进行湿式蚀刻而形成的。 或者，通过用光致抗蚀剂掩模的单等离子体蚀刻工艺顺序地沉积钛 - 钨和铂层并图案化。

公开(公告)号：US20180369862A1

公开(公告)日：2018-12-27

申请号：US16012999

申请日：2018-06-20

申请人： Susan A. Alie ,  Keith G. Fife ,  Joseph Lutsky ,  David Grosjean

发明人： Susan A. Alie ,  Keith G. Fife ,  Joseph Lutsky ,  David Grosjean

IPC分类号： B06B1/02 ,  B81C1/00 ,  G01N29/24 ,  B81B3/00

摘要： An ultrasonic transducer includes a membrane, a bottom electrode, and a plurality of cavities disposed between the membrane and the bottom electrode, each of the plurality of cavities corresponding to an individual transducer cell. Portions of the bottom electrode corresponding to each individual transducer cell are electrically isolated from one another. Each portion of the bottom electrode corresponds to each individual transducer that cell further includes a first bottom electrode portion and a second bottom electrode portion, the first and second bottom electrode portions electrically isolated from one another.

公开(公告)号：US20170365774A1

公开(公告)日：2017-12-21

申请号：US15626330

申请日：2017-06-19

申请人： Jonathan M. Rothberg ,  Susan A. Alie ,  Jaime Scott Zahorian ,  Paul Francis Cristman ,  Keith G. Fife

发明人： Jonathan M. Rothberg ,  Susan A. Alie ,  Jaime Scott Zahorian ,  Paul Francis Cristman ,  Keith G. Fife

IPC分类号： H01L41/27 ,  H01L41/047 ,  B06B1/06 ,  H05K3/36

CPC分类号： H01L41/27 ,  B06B1/0292 ,  B06B1/06 ,  B06B1/0622 ,  H01L41/047 ,  H05K3/361 ,  H05K2201/10977 ,  H05K2203/0726

摘要： An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.

公开(公告)号：US06821561B2

公开(公告)日：2004-11-23

申请号：US10106385

申请日：2002-03-26

申请人： Javier Villarreal ,  Susan A. Alie

发明人： Javier Villarreal ,  Susan A. Alie

IPC分类号： C23C1404

CPC分类号： C23C14/042

摘要： A shadow mask material is selected so that the expansion characteristics of the shadow mask during thin film deposition closely match the expansion characteristics of the substrate. The shadow mask material is typically one with a low coefficient of thermal expansion (CTE). The shadow mask material must typically meet additional criteria, such as mechanical strength, feature quality, and dimensional accuracy criteria.

摘要翻译： 选择阴影掩模材料，使得薄膜沉积期间荫罩的膨胀特性与基板的膨胀特性紧密匹配。 荫罩材料通常是具有低热膨胀系数（CTE）的材料。 荫罩材料通常必须符合额外的标准，例如机械强度，特征质量和尺寸精度标准。

公开(公告)号：US20190142387A1

公开(公告)日：2019-05-16

申请号：US16192603

申请日：2018-11-15

申请人： Kailiang Chen ,  Nevada J. Sanchez ,  Susan A. Alie ,  Tyler S. Ralston ,  Jonathan M. Rothberg ,  Keith G. Fife ,  Joseph Lutsky

发明人： Kailiang Chen ,  Nevada J. Sanchez ,  Susan A. Alie ,  Tyler S. Ralston ,  Jonathan M. Rothberg ,  Keith G. Fife ,  Joseph Lutsky

IPC分类号： A61B8/08 ,  H04B11/00

摘要： Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.

公开(公告)号：US20170360399A1

公开(公告)日：2017-12-21

申请号：US15626711

申请日：2017-06-19

申请人： Jonathan M. Rothberg ,  Susan A. Alie ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Christopher Thomas McNulty ,  Jaime Scott Zahorian ,  Paul Francis Cristman ,  Matthew de Jonge ,  Keith G. Fife

发明人： Jonathan M. Rothberg ,  Susan A. Alie ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Christopher Thomas McNulty ,  Jaime Scott Zahorian ,  Paul Francis Cristman ,  Matthew de Jonge ,  Keith G. Fife

IPC分类号： A61B8/00

CPC分类号： A61B8/4477 ,  A61B8/0883 ,  A61B8/0891 ,  A61B8/12 ,  A61B8/4236 ,  A61B8/4427 ,  A61B8/4444 ,  A61B8/4472 ,  A61B8/4494 ,  A61B8/465 ,  A61B8/467 ,  A61B8/483 ,  A61B8/485 ,  A61B8/488 ,  A61B8/5207 ,  A61B8/54 ,  A61B8/56 ,  B06B1/0292 ,  B06B1/0622

摘要： A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.

公开(公告)号：US06936918B2

公开(公告)日：2005-08-30

申请号：US10827680

申请日：2004-04-19

申请人： Kieran P. Harney ,  Lawrence E. Felton ,  Thomas Kieran Nunan ,  Susan A. Alie ,  Bruce Wachtmann

发明人： Kieran P. Harney ,  Lawrence E. Felton ,  Thomas Kieran Nunan ,  Susan A. Alie ,  Bruce Wachtmann

IPC分类号： B81B7/00 ,  B81B7/02 ,  H01L23/12

CPC分类号： B81B7/007 ,  B81B2201/0235 ,  B81C2203/019 ,  H01L2224/16225 ,  H01L2924/1461

摘要： A MEMS device has at least one conductive path extending from the top facing side of its substrate (having MEMS structure) to the bottom side of the noted substrate. The at least one conductive path extends through the substrate as noted to electrically connect the bottom facing side with the MEMS structure.

摘要翻译： MEMS器件具有从其衬底（具有MEMS结构）的顶面侧延伸到所述衬底的底侧的至少一个导电路径。 所述至少一个导电路径延伸穿过衬底，如将所述底面朝向侧面与MEMS结构电连接。

公开(公告)号：US06508561B1

公开(公告)日：2003-01-21

申请号：US09981369

申请日：2001-10-17

申请人： Susan A. Alie ,  Allyson Hartzell ,  Maurice Karpman ,  John R. Martin ,  Kieran Nunan

发明人： Susan A. Alie ,  Allyson Hartzell ,  Maurice Karpman ,  John R. Martin ,  Kieran Nunan

IPC分类号： G02B7182

CPC分类号： G02B26/0833 ,  G02B5/0875

摘要： Optical mirror coatings are used for high-temperature diffusion barriers and mirror shaping. Certain materials for use as high-temperature diffusion barriers under optical mirror coatings include metals that have high melting and/or boiling points and amorphous and partially recrystallized inorganic amorphous materials that have high glass transition temperatures (Tg). Candidate metals are selected based upon the boiling point or a combination of melting point and boiling point. Candidate amorphous and partially recrystallized inorganic amorphous materials are selected based upon the glass transition temperature. Optical mirrors having such high-temperature diffusion barriers maintain reflectivity when exposed to elevated temperatures, and are particularly useful in optical Micro Electro-Mechanical Systems (MEMS) that are exposed to high-temperature manufacturing processes. Optical mirrors are shaped using tensile and/or compressive films.

摘要翻译： 光学镜面涂层用于高温扩散屏障和镜面成型。 在光镜涂层下用作高温扩散阻挡层的某些材料包括具有高熔点和/或沸点的金属和具有高玻璃化转变温度（Tg）的无定形和部分再结晶的无机非晶材料。 基于沸点或熔点和沸点的组合选择候选金属。 基于玻璃化转变温度选择候选无定形和部分重结晶的无机非晶材料。 具有这种高温扩散屏障的光学反射镜在暴露于升高的温度时保持反射性，并且在暴露于高温制造工艺的光学微机电系统（MEMS）中特别有用。 光学反射镜使用拉伸和/或压缩薄膜成型。