发明授权
- 专利标题： Load cup for chemical mechanical polishing
- 专利标题（中）： 负载杯用于化学机械抛光
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申请号： US10988647申请日： 2004-11-15
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公开(公告)号： US07044832B2公开(公告)日： 2006-05-16
- 发明人: Alpay Yilmaz , Simon Yavelberg , Toshikazu Tomita , Hui Chen , Noel Manto , David J. Lischka , Hung Chih Chen
- 申请人： Alpay Yilmaz , Simon Yavelberg , Toshikazu Tomita , Hui Chen , Noel Manto , David J. Lischka , Hung Chih Chen
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials
- 当前专利权人： Applied Materials
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patterson and Sheridan
- 主分类号： B24B49/00
- IPC分类号： B24B49/00
摘要：
Embodiments of a load cup for transferring a substrate are provided. The load cup includes a pedestal assembly having a substrate support and a de-chucking nozzle. The de-chucking nozzle is positioned to flow a fluid between the polishing head and the back side of a substrate during transfer of the substrate from the polishing head to the substrate support.
公开/授权文献
- US20050176349A1 Load cup for chemical mechanical polishing 公开/授权日：2005-08-11
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