PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING
    2.
    发明申请
    PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING 有权
    基于峰值的化学机械抛光的终点

    公开(公告)号:US20110287694A1

    公开(公告)日:2011-11-24

    申请号:US13198602

    申请日:2011-08-04

    IPC分类号: B24B49/00

    摘要: A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.

    摘要翻译: 抛光系统接收光谱中所选峰的一个或多个目标参数,抛光衬底,在衬底被抛光时测量从衬底反射的光的当前光谱,识别当前光谱中所选择的峰,测量 当前频谱中所选峰的一个或多个当前参数将所选峰的当前参数与目标参数进行比较,并且当当前参数和目标参数具有预定关系时,停止抛光衬底。

    Sealed polishing pad, system and methods
    3.
    发明授权
    Sealed polishing pad, system and methods 失效
    密封抛光垫,系统和方法

    公开(公告)号:US07210980B2

    公开(公告)日:2007-05-01

    申请号:US11213623

    申请日:2005-08-26

    IPC分类号: B24B7/22

    CPC分类号: B24B37/205 B24D18/00

    摘要: A polishing pad, polishing system, method of making a polishing pad and method of using a polishing pad. The polishing pad includes a polishing layer having a polishing surface, a backing layer with an aperture and a first portion that is permeable to liquid, and a sealant that penetrates a second portion of the backing layer adjacent to and surrounding the aperture such that the second portion is substantially impermeable to liquid. The aperture is positioned below a substantially fluid-impermeable element.

    摘要翻译: 抛光垫,抛光系统,制造抛光垫的方法和抛光垫的使用方法。 抛光垫包括具有抛光表面的抛光层,具有孔的背衬层和可渗透液体的第一部分,以及密封剂,该密封剂穿透邻近并包围孔的背衬层的第二部分,使得第二 部分对液体基本上是不可渗透的。 孔被定位在基本上不透液体的元件之下。

    Methods and apparatus for sensing a substrate in a load cup
    4.
    发明授权
    Methods and apparatus for sensing a substrate in a load cup 有权
    用于感测负载杯中的衬底的方法和装置

    公开(公告)号:US09013176B2

    公开(公告)日:2015-04-21

    申请号:US13360342

    申请日:2012-01-27

    IPC分类号: G01B7/14 G01B7/02

    CPC分类号: G01B7/023

    摘要: Methods, apparatus, and systems are provided for detecting the presence of a substrate in a load cup. The invention includes a proximity sensor having a detection pad disposed below a contact surface of a load cup assembly and a target disposed on a lever member and adapted to move toward the detection pad when a substrate is placed on the lever member and adapted to move away from the detection pad when a substrate is removed from the lever member. Numerous additional aspects are disclosed.

    摘要翻译: 提供了用于检测负载杯中的衬底的存在的方法,装置和系统。 本发明包括接近传感器,其具有设置在负载杯组件的接触表面下方的检测垫和设置在杆构件上的靶,并且当衬底放置在杆构件上并适于移动时, 当从所述杆构件移除基板时,从所述检测垫开始。 公开了许多附加方面。

    Peak-based endpointing for chemical mechanical polishing
    5.
    发明授权
    Peak-based endpointing for chemical mechanical polishing 有权
    基于峰值的化学机械抛光终点

    公开(公告)号:US07998358B2

    公开(公告)日:2011-08-16

    申请号:US11555171

    申请日:2006-10-31

    IPC分类号: C03C15/00

    摘要: A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.

    摘要翻译: 抛光系统接收光谱中所选峰的一个或多个目标参数,抛光衬底,在衬底被抛光时测量从衬底反射的光的当前光谱,识别当前光谱中所选择的峰,测量 当前频谱中所选峰的一个或多个当前参数将所选峰的当前参数与目标参数进行比较,并且当当前参数和目标参数具有预定关系时,停止抛光衬底。

    Reducing polishing pad deformation
    6.
    发明授权
    Reducing polishing pad deformation 有权
    减少抛光垫变形

    公开(公告)号:US07621798B1

    公开(公告)日:2009-11-24

    申请号:US11683392

    申请日:2007-03-07

    IPC分类号: B24B49/12

    CPC分类号: B24B37/205

    摘要: A chemical mechanical polishing pad is described. A chemical mechanical polishing pad has an outer layer that includes a polishing surface, a first thinned region defined by a recess on a bottom surface of the pad, a first thick region surrounding the first thinned region, a second thinned region surrounding the first thick region, and a second thick region surrounding the second thinned region. The first thick region is not vertically extendable. The second thinned region defines one or more flexure mechanisms configured to make the first thinned region and the first thick region movable relative to the second thick region in a direction parallel or substantially parallel to the polishing surface.

    摘要翻译: 描述了化学机械抛光垫。 化学机械抛光垫具有包括抛光表面的外层,由垫的底表面上的凹部限定的第一变薄区域,围绕第一稀化区域的第一厚区域,围绕第一厚区域的第二变薄区域 以及围绕第二变薄区域的第二厚区域。 第一厚区域不是可垂直延伸的。 第二变薄区域限定一个或多个弯曲机构,其被配置为使得第一变薄区域和第一厚区域能够在平行于或基本上平行于抛光表面的方向上相对于第二厚区域移动。

    Reducing polishing pad deformation
    7.
    发明授权
    Reducing polishing pad deformation 有权
    减少抛光垫变形

    公开(公告)号:US08287330B1

    公开(公告)日:2012-10-16

    申请号:US12625412

    申请日:2009-11-24

    IPC分类号: B24B49/12

    CPC分类号: B24B37/205

    摘要: A chemical mechanical polishing pad is described. A chemical mechanical polishing pad has an outer layer that includes a polishing surface, a first thinned region defined by a recess on a bottom surface of the pad, a first thick region surrounding the first thinned region, a second thinned region surrounding the first thick region, and a second thick region surrounding the second thinned region. The first thick region is not vertically extendable. The second thinned region defines one or more flexure mechanisms configured to make the first thinned region and the first thick region movable relative to the second thick region in a direction parallel or substantially parallel to the polishing surface.

    摘要翻译: 描述了化学机械抛光垫。 化学机械抛光垫具有包括抛光表面的外层,由垫的底表面上的凹部限定的第一变薄区域,围绕第一稀化区域的第一厚区域,围绕第一厚区域的第二变薄区域 以及围绕第二变薄区域的第二厚区域。 第一厚区域不是可垂直延伸的。 第二变薄区域限定一个或多个弯曲机构,其被配置为使得第一变薄区域和第一厚区域能够在平行于或基本上平行于抛光表面的方向上相对于第二厚区域移动。

    Sealed polishing pad methods
    8.
    发明授权
    Sealed polishing pad methods 失效
    密封抛光垫方法

    公开(公告)号:US07112119B1

    公开(公告)日:2006-09-26

    申请号:US11400416

    申请日:2006-04-06

    IPC分类号: B24B7/00

    CPC分类号: B24B37/205 B24D18/00

    摘要: A polishing pad, polishing system, method of making a polishing pad and method of using a polishing pad. The polishing pad includes a polishing layer having a polishing surface, a backing layer with an aperture and a first portion that is permeable to liquid, and a sealant that penetrates a second portion of the backing layer adjacent to and surrounding the aperture such that the second portion is substantially impermeable to liquid. The aperture is positioned below a substantially fluid-impermeable element.

    摘要翻译: 抛光垫,抛光系统,制造抛光垫的方法和抛光垫的使用方法。 抛光垫包括具有抛光表面的抛光层,具有孔的背衬层和可渗透液体的第一部分,以及密封剂,该密封剂穿透邻近并包围孔的背衬层的第二部分,使得第二 部分对液体基本上是不可渗透的。 孔被定位在基本上不透液体的元件之下。

    Peak-based endpointing for chemical mechanical polishing
    9.
    发明授权
    Peak-based endpointing for chemical mechanical polishing 有权
    基于峰值的化学机械抛光终点

    公开(公告)号:US08591698B2

    公开(公告)日:2013-11-26

    申请号:US13198602

    申请日:2011-08-04

    IPC分类号: B24B49/00

    摘要: A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.

    摘要翻译: 抛光系统接收光谱中所选峰的一个或多个目标参数,抛光衬底,在衬底被抛光时测量从衬底反射的光的当前光谱,识别当前光谱中所选择的峰,测量 当前频谱中所选峰的一个或多个当前参数将所选峰的当前参数与目标参数进行比较,并且当当前参数和目标参数具有预定关系时,停止抛光衬底。

    METHODS AND APPARATUS FOR SENSING A SUBSTRATE IN A LOAD CUP
    10.
    发明申请
    METHODS AND APPARATUS FOR SENSING A SUBSTRATE IN A LOAD CUP 有权
    用于感测负载杯中的基底的方法和装置

    公开(公告)号:US20130193956A1

    公开(公告)日:2013-08-01

    申请号:US13360342

    申请日:2012-01-27

    IPC分类号: G01B7/14

    CPC分类号: G01B7/023

    摘要: Methods, apparatus, and systems are provided for detecting the presence of a substrate in a load cup. The invention includes a proximity sensor having a detection pad disposed below a contact surface of a load cup assembly and a target disposed on a lever member and adapted to move toward the detection pad when a substrate is placed on the lever member and adapted to move away from the detection pad when a substrate is removed from the lever member. Numerous additional aspects are disclosed.

    摘要翻译: 提供了用于检测负载杯中的衬底的存在的方法,装置和系统。 本发明包括接近传感器,其具有设置在负载杯组件的接触表面下方的检测垫和设置在杆构件上的靶,并且当衬底放置在杆构件上并适于移动时, 当从所述杆构件移除基板时,从所述检测垫开始。 公开了许多附加方面。