Invention Grant
- Patent Title: Active semiconductor component with an optimized surface area
- Patent Title (中): 具有优化表面积的有源半导体元件
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Application No.: US10763579Application Date: 2004-01-22
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Publication No.: US07053404B2Publication Date: 2006-05-30
- Inventor: Jean-Luc Morand
- Applicant: Jean-Luc Morand
- Applicant Address: FR Montrouge
- Assignee: STMicroelectronics S.A.
- Current Assignee: STMicroelectronics S.A.
- Current Assignee Address: FR Montrouge
- Agency: Wolf, Greenfield & Sacks, P.C.
- Agent Lisa K. Jorgenson; James H. Morris
- Priority: FR0350987 20031205
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/88
Abstract:
A semiconductor component in which the active junctions extend along at least one cylinder perpendicular to the main surfaces of a semiconductor chip substantially across the entire thickness thereof, said cylinder(s) having a cross-section with an undulated closed curve shape.
Public/Granted literature
- US20050121732A1 Active semiconductor component with an optimized surface area Public/Granted day:2005-06-09
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