发明授权
- 专利标题： Electronic device
-
申请号： US09880733申请日： 2001-06-12
-
公开(公告)号： US07075183B2公开(公告)日： 2006-07-11
- 发明人: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
- 申请人： Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
- 申请人地址： JP Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Townsend and Townsend and Crew LLP
- 优先权： JP2000-180719 20000612; JP2000-396905 20001225
- 主分类号： H01L29/40
- IPC分类号： H01L29/40
摘要：
Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu etc. and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.
公开/授权文献
- US20020171157A1 Electronic device 公开/授权日：2002-11-21