- 专利标题： Substrate removal from polishing tool
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申请号： US11004223申请日： 2004-12-02
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公开(公告)号： US07081042B2公开(公告)日： 2006-07-25
- 发明人: Hung Chih Chen , Steven M. Zuniga , Tsz-Sin Siu
- 申请人： Hung Chih Chen , Steven M. Zuniga , Tsz-Sin Siu
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials
- 当前专利权人： Applied Materials
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Fish & Richardson
- 主分类号： B24B1/00
- IPC分类号： B24B1/00
摘要：
Techniques for removing a substrate from a polishing pad are described. A substrate is pulled away from the polishing pad such that the edges of the substrate are pulled away from the polishing pad before the center of the substrate is pulled from the polishing pad.
公开/授权文献
- US20060019582A1 Substrate removal from polishing tool 公开/授权日：2006-01-26
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