发明授权
- 专利标题： Microelectronic assemblies having low profile connections
- 专利标题（中）： 具有薄型连接的微电子组件
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申请号： US10699328申请日： 2003-10-31
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公开(公告)号： US07098074B2公开(公告)日： 2006-08-29
- 发明人: Michael Warner , Masud Beroz , David Light , Delin Li , Dennis Castillo , Hung-ming Wang , John W. Smith
- 申请人： Michael Warner , Masud Beroz , David Light , Delin Li , Dennis Castillo , Hung-ming Wang , John W. Smith
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.
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