公开(公告)号：US07098074B2

公开(公告)日：2006-08-29

申请号：US10699328

申请日：2003-10-31

申请人： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John W. Smith

发明人： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John W. Smith

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/10 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05124

摘要： A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.

摘要翻译： 公开了一种制造微电子封装的方法。 将材料施加到微电子元件的第一主表面以减小从第一主表面突出的突起的高度。 微电子元件组装到微电子元件上。 还公开了一种形成突起的方法和包括具有突起的微电子元件的组件。

公开(公告)号：US20060275951A1

公开(公告)日：2006-12-07

申请号：US11487880

申请日：2006-07-17

申请人： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John Smith

发明人： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John Smith

IPC分类号： H01L21/00

CPC分类号： H01L24/10 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05124

摘要： A microelectronic assembly includes a first microelectronic element having a first face and contacts accessible at the first face, and a layer of a dielectric material having a bottom surface contacting the first microelectronic element, a top surface facing away from the first microelectronic element and holes extending between the top and bottom faces in alignment with the contacts on the first microelectronic element. The assembly includes conductive protrusions extending through the holes to the contacts, the conductive protrusions projecting beyond the top surface of the dielectric layer. The assembly also has a second microelectronic element having a first surface with conductive elements being accessible at the first surface thereof, the second microelectronic element being assembled with the first microelectronic element so that the contacts of the second microelectronic element are connected with the conductive protrusions and the top surface of the dielectric layer is spaced from the first surface of the second microelectronic element.

摘要翻译： 微电子组件包括具有第一面和在第一面可接触的触点的第一微电子元件和具有接触第一微电子元件的底表面的电介质材料层，背离第一微电子元件的顶表面和延伸 在顶面和底面之间，与第一微电子元件上的触点对齐。 组件包括延伸穿过孔到触头的导电突起，导电突出部突出超过电介质层的顶表面。 组件还具有第二微电子元件，其具有第一表面，其导电元件在其第一表面处可访问，第二微电子元件与第一微电子元件组装，使得第二微电子元件的触点与导电突起连接， 电介质层的顶表面与第二微电子元件的第一表面间隔开。