Invention Grant
- Patent Title: Microelectronic assemblies having low profile connections
- Patent Title (中): 具有薄型连接的微电子组件
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Application No.: US10699328Application Date: 2003-10-31
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Publication No.: US07098074B2Publication Date: 2006-08-29
- Inventor: Michael Warner , Masud Beroz , David Light , Delin Li , Dennis Castillo , Hung-ming Wang , John W. Smith
- Applicant: Michael Warner , Masud Beroz , David Light , Delin Li , Dennis Castillo , Hung-ming Wang , John W. Smith
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.
Public/Granted literature
- US20040219716A1 Microelectronic assemblies having low profile connections Public/Granted day:2004-11-04
Information query
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