发明授权
US07098149B2 Mechanical enhancement of dense and porous organosilicate materials by UV exposure
有权
通过紫外线曝光机械增强致密和多孔有机硅酸盐材料
- 专利标题： Mechanical enhancement of dense and porous organosilicate materials by UV exposure
- 专利标题（中）： 通过紫外线曝光机械增强致密和多孔有机硅酸盐材料
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申请号： US10379466申请日： 2003-03-04
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公开(公告)号： US07098149B2公开(公告)日： 2006-08-29
- 发明人: Aaron Scott Lukas , Mark Leonard O'Neill , Jean Louise Vincent , Raymond Nicholas Vrtis , Mark Daniel Bitner , Eugene Joseph Karwacki, Jr.
- 申请人： Aaron Scott Lukas , Mark Leonard O'Neill , Jean Louise Vincent , Raymond Nicholas Vrtis , Mark Daniel Bitner , Eugene Joseph Karwacki, Jr.
- 申请人地址： US PA Allentown
- 专利权人： Air Products and Chemicals, Inc.
- 当前专利权人： Air Products and Chemicals, Inc.
- 当前专利权人地址： US PA Allentown
- 代理商 Rosaleen P. Morris-Oskanian
- 主分类号： H01L21/31
- IPC分类号： H01L21/31
摘要：
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. In one aspect of the present invention, an organosilicate glass film is exposed to an ultraviolet light source wherein the film after exposure has an at least 10% or greater improvement in its mechanical properties (i.e., material hardness and elastic modulus) compared to the as-deposited film.