发明授权
- 专利标题： Method of fabrication of semiconductor integrated circuit device
- 专利标题（中）： 半导体集成电路器件制造方法
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申请号： US10475142申请日： 2002-04-04
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公开(公告)号： US07098156B2公开(公告)日： 2006-08-29
- 发明人: Takayuki Wakabayashi , Toshiyuki Uchino , Yasuo Kiguchi , Atsuyoshi Koike
- 申请人： Takayuki Wakabayashi , Toshiyuki Uchino , Yasuo Kiguchi , Atsuyoshi Koike
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout and Kraus, LLP.
- 优先权： JP2001-121735 20010419
- 国际申请： PCT/JP02/03391 WO 20020404
- 国际公布： WO02/086963 WO 20021031
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
The conveyance of wafers in bays (equipment groups) of a clean room is performed by RGVs (Rail Guided Vehicles) that linearly travel at high speed on conveying rails laid on the floor of the clean room. A structure is adopted wherein a conveying area, over which the RGV travels, is separated from a human working area by a compartment (partition), and a human is not allowed to enter the conveying area upon operation of a line.
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