公开(公告)号：US5001327A

公开(公告)日：1991-03-19

申请号：US242175

申请日：1988-09-09

申请人： Shigeki Hirasawa ,  Takuji Torii ,  Tomoji Watanabe ,  Toshihiro Komatsu ,  Kazuo Honma ,  Akihiko Sakai ,  Tetsuya Takagaki ,  Toshiyuki Uchino ,  Hiroto Nagazomo

发明人： Shigeki Hirasawa ,  Takuji Torii ,  Tomoji Watanabe ,  Toshihiro Komatsu ,  Kazuo Honma ,  Akihiko Sakai ,  Tetsuya Takagaki ,  Toshiyuki Uchino ,  Hiroto Nagazomo

IPC分类号： H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  H01L21/687

CPC分类号： H01L21/67751 ,  H01L21/67109 ,  H01L21/67313 ,  Y10S414/135 ,  Y10S414/138

摘要： An apparatus for containing semiconductor wafers and performing heat treatment thereon. Heaters disposed in a high temperature furnace form at least one heating space therein. An insertion and retrieval aperture is disposed at the lower portion of each heating space for allowing passage of wafers therethrough. Each of the heating spaces is adapted to receive one or two wafers and to provide simultaneous and uniform heat treatment on the wafers.

公开(公告)号：US07098156B2

公开(公告)日：2006-08-29

申请号：US10475142

申请日：2002-04-04

申请人： Takayuki Wakabayashi ,  Toshiyuki Uchino ,  Yasuo Kiguchi ,  Atsuyoshi Koike

发明人： Takayuki Wakabayashi ,  Toshiyuki Uchino ,  Yasuo Kiguchi ,  Atsuyoshi Koike

IPC分类号： H01L21/00

CPC分类号： H01L21/67724 ,  G05B19/41895 ,  H01L21/67173 ,  H01L21/67727 ,  Y02P90/285 ,  Y02P90/60 ,  Y10S414/135

摘要： The conveyance of wafers in bays (equipment groups) of a clean room is performed by RGVs (Rail Guided Vehicles) that linearly travel at high speed on conveying rails laid on the floor of the clean room. A structure is adopted wherein a conveying area, over which the RGV travels, is separated from a human working area by a compartment (partition), and a human is not allowed to enter the conveying area upon operation of a line.

摘要翻译： 在洁净室的托架（设备组）中输送硅片由RGV（轨道导引车辆）执行，该车辆在洁净室地板上的输送轨道上高速线性行进。 采用这样的结构，其中RGV行进的输送区域通过隔室（分隔）与人工作区域分离，并且在操作线路时不允许人进入输送区域。

公开(公告)号：US06462411B1

公开(公告)日：2002-10-08

申请号：US09205299

申请日：1998-12-04

申请人： Tomoji Watanabe ,  Nobuyuki Mise ,  Toshiyuki Uchino ,  Norio Suzuki ,  Yoshihiko Sakurai ,  Toshiya Uenishi ,  Yohsuke Inoue ,  Yasuhiro Inokuchi ,  Fumihide Ikeda

发明人： Tomoji Watanabe ,  Nobuyuki Mise ,  Toshiyuki Uchino ,  Norio Suzuki ,  Yoshihiko Sakurai ,  Toshiya Uenishi ,  Yohsuke Inoue ,  Yasuhiro Inokuchi ,  Fumihide Ikeda

IPC分类号： H01L2334

CPC分类号： H01L21/67748 ,  H01L21/67109 ,  H01L21/68735 ,  H01L21/6875 ,  H01L21/68785 ,  Y10T29/41

摘要： A semiconductor wafer processing apparatus comprises a reaction furnace capable of heating inside thereof, a wafer mount for mounting a semiconductor wafer thereon and a transfer device. The wafermount includes an opening which is greater than the semiconductor wafer and which has a circle shape or a shape substantially similar to an outer periphery of the semiconductor wafer, and includes a wafer supporting portion projecting inwardly of the opening for supporting the semiconductor wafer. The transfer device is capable of holding the wafer mount outside the semiconductor wafer as viewed from a vertical direction, and transferring the wafer mount carrying the semiconductor wafer thereon substantially horizontally into and/or out from the reaction furnace.

摘要翻译： 半导体晶片处理装置包括能够在其内部加热的反应炉，用于将半导体晶片安装在其上的晶片载体和转印装置。 所述瓦台车包括比所述半导体晶片大的开口部，该开口部具有与所述半导体晶片的外周大致相同的圆形或形状，并且具有向所述开口的内侧突出以支撑所述半导体晶片的晶片支撑部。 传送装置能够从垂直方向观察时将晶片安装体保持在半导体晶片外部，并将承载半导体晶片的晶片载体基本水平地转移到反应炉内和/或从反应炉出来。