Invention Grant
- Patent Title: Thin capacitive structure
- Patent Title (中): 薄电容结构
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Application No.: US10360267Application Date: 2003-02-05
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Publication No.: US07098501B2Publication Date: 2006-08-29
- Inventor: Weiran Kong , Bernard Ho , David Greenhill , Sudhakar Bobba
- Applicant: Weiran Kong , Bernard Ho , David Greenhill , Sudhakar Bobba
- Applicant Address: US CA Santa Clara
- Assignee: Sun Microsystems, Inc.
- Current Assignee: Sun Microsystems, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Martine Penilla & Gencarella, LLP.
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/76 ; H01L29/94

Abstract:
A capacitor structure in a semiconductor device is provided. The capacitor structure includes a first power rail on a topmost level of the semiconductor device, and a second power rail on the topmost level of the semiconductor device. The capacitor structure also includes a dielectric layer disposed over at least a portion of one of the first power rail and the second power rail. The capacitor structure further includes a conductive layer disposed over and between the first power rail and the second power rail where the conductive layer is in electrical contact with the power rail not having the dielectric layer, and the conductive layer is disposed over the dielectric layer.
Public/Granted literature
- US20040150026A1 Metal insulator metal capacitor Public/Granted day:2004-08-05
Information query
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