发明授权
- 专利标题： Absorber layer for DSA processing
- 专利标题（中）： 吸收层用于DSA处理
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申请号： US10679189申请日： 2003-10-03
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公开(公告)号： US07109087B2公开(公告)日： 2006-09-19
- 发明人: Luc Van Autryve , Chris D. Bencher , Dean Jennings , Haifan Liang , Abhilash J. Mayur , Mark Yam , Wendy H. Yeh , Richard A. Brough
- 申请人： Luc Van Autryve , Chris D. Bencher , Dean Jennings , Haifan Liang , Abhilash J. Mayur , Mark Yam , Wendy H. Yeh , Richard A. Brough
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patterson & Sheridan, LLP
- 主分类号： H01L21/336
- IPC分类号： H01L21/336 ; H01L21/425 ; H01L21/26
摘要：
A method of processing a substrate comprising depositing a layer comprising amorphous carbon on the substrate and then laser annealing the substrate is provided. Optionally, the layer further comprises a dopant selected from the group consisting of nitrogen, boron, phosphorus, fluorine, and combinations thereof. In one aspect, the layer comprising amorphous carbon is an anti-reflective coating and an absorber layer that absorbs electromagnetic radiation emitted by the laser and anneals a top surface layer of the substrate.
公开/授权文献
- US20050074956A1 Absorber layer for DSA processing 公开/授权日：2005-04-07
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