Invention Grant
- Patent Title: Combined high speed optical profilometer and ellipsometer
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Application No.: US11268214Application Date: 2005-11-07
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Publication No.: US07110097B2Publication Date: 2006-09-19
- Inventor: Steven W. Meeks , Rusmin Kudinar
- Applicant: Steven W. Meeks , Rusmin Kudinar
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Technologies Corporation
- Current Assignee: KLA-Tencor Technologies Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Caven & Aghevil LLC
- Main IPC: G01N21/00
- IPC: G01N21/00
Abstract:
A system and method for measuring defects, film thickness, contamination, particles and height of a thin film disk or a silicon wafer.
Public/Granted literature
- US20060066854A1 Combined high speed optical profilometer and ellipsometer Public/Granted day:2006-03-30
Information query
