发明授权
US07122424B2 Method for making improved bottom electrodes for metal-insulator-metal crown capacitors
有权
用于金属绝缘体金属冠电容器的改进的底部电极的方法
- 专利标题: Method for making improved bottom electrodes for metal-insulator-metal crown capacitors
- 专利标题(中): 用于金属绝缘体金属冠电容器的改进的底部电极的方法
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申请号: US10788175申请日: 2004-02-26
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公开(公告)号: US07122424B2公开(公告)日: 2006-10-17
- 发明人: Yeur-Luen Tu , Yuan-Hung Liu , Chi-Hsin Lo , Chia-Shiung Tsai
- 申请人: Yeur-Luen Tu , Yuan-Hung Liu , Chi-Hsin Lo , Chia-Shiung Tsai
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Thomas, Kayden, Horstemeyer & Risley
- 主分类号: H01L21/8242
- IPC分类号: H01L21/8242
摘要:
A method for making crown-shaped capacitors with uniform capacitance from the center to the edge of the DRAM device is achieved. The uniform capacitance is achieved using a two-step planarization process or a uniformly deposited CVD sacrificial layer. After forming a first conducting layer in openings in an insulator, a sacrificial layer is spin coated on the substrate. The non-uniformity, by virtue of the spin coating, is then partially polished back to form a globally uniform surface followed by a plasma etch-back to leave portions of the sacrificial layer of equal height in the openings. The first conducting layer in the openings is uniformly recessed for making capacitors having uniform values across the DRAM device. In a second approach a relatively thin uniform CVD polymer is deposited requiring only a single polishing step or etch-back to achieve uniform portions of the polymer in the openings.
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