发明授权
- 专利标题： Method for manufacturing a wiring board
- 专利标题（中）： 线路板制造方法
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申请号： US11023478申请日： 2004-12-29
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公开(公告)号： US07134193B2公开(公告)日： 2006-11-14
- 发明人: Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
- 申请人： Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
- 申请人地址： JP Tokyo
- 专利权人： Dai Nippon Printing Co., Ltd.
- 当前专利权人： Dai Nippon Printing Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权： JPP9-155462 19970612
- 主分类号： H01R43/00
- IPC分类号： H01R43/00
摘要：
The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.
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