发明授权
- 专利标题: Reducing gate dielectric material to form a metal gate electrode extension
- 专利标题(中): 减少栅介质材料形成金属栅电极延伸
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申请号: US10835791申请日: 2004-04-30
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公开(公告)号: US07144783B2公开(公告)日: 2006-12-05
- 发明人: Suman Datta , Justin K. Brask , Jack Kavalieros , Mark L. Doczy , Matthew Metz , Robert S. Chau
- 申请人: Suman Datta , Justin K. Brask , Jack Kavalieros , Mark L. Doczy , Matthew Metz , Robert S. Chau
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Trop, Pruner & Hu, P.C.
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L21/4763
摘要:
In a metal gate replacement process, a cup-shaped gate metal oxide dielectric may have vertical portions that may be exposed to a reduction reaction. As a result of the reduction reaction, the vertical portions may be converted to metal, which adds to the existing gate electrode. In some cases, removing the vertical dielectric portions reduces fringe capacitance and may also advantageously slightly increased underdiffusion without adding heat, in some embodiments.
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