An improved strain gage and an improved manufacturing method are disclosed. The strain gage includes a semi-rigid substrate having a thickness of 3 to 30 mils, a resistive strain sensitive foil bonded to the semi-rigid substrate for providing a resistance varying with strain associated with a surface to which the strain gage is attached, a first and a second terminal operatively connected to the resistive strain sensitive foil, and an anti-static layer. The improved strain gage allows for reduced labor content in manufacturing by allowing use of modern automated electronic component manufacturing equipment.