发明授权
- 专利标题： Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
- 专利标题（中）： 估算抛光轮廓或抛光量的方法，抛光方法和抛光装置
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申请号： US11176184申请日： 2005-07-08
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公开(公告)号： US07150673B2公开(公告)日： 2006-12-19
- 发明人: Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
- 申请人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
- 申请人地址： JP Tokyo
- 专利权人： Ebara Corporation
- 当前专利权人： Ebara Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2004-202970 20040709
- 主分类号： B24B49/00
- IPC分类号： B24B49/00 ; G06F19/00
摘要：
A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.