Invention Grant
- Patent Title: Methods of forming silicide films in semiconductor devices
- Patent Title (中): 在半导体器件中形成硅化物膜的方法
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Application No.: US10866643Application Date: 2004-06-10
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Publication No.: US07153772B2Publication Date: 2006-12-26
- Inventor: Ernst H. A. Granneman , Vladimir Kuznetsov , Xavier Pages , Cornelius A. van der Jeugd
- Applicant: Ernst H. A. Granneman , Vladimir Kuznetsov , Xavier Pages , Cornelius A. van der Jeugd
- Applicant Address: NL
- Assignee: ASM International N.V.
- Current Assignee: ASM International N.V.
- Current Assignee Address: NL
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: H01L21/44
- IPC: H01L21/44

Abstract:
A method of self-aligned silicidation involves interruption of the silicidation process prior to complete reaction of the blanket material (e.g., metal) in regions directly overlying patterned and exposed other material (e.g., silicon). Diffusion of excess blanket material from over other regions (e.g., overlying insulators) is thus prevented. Control and uniformity are insured by use of conductive rapid thermal annealing in hot wall reactors, with massive heated plates closely spaced from the substrate surfaces. Interruption is particularly facilitated by forced cooling, preferably also by conductive thermal exchange with closely spaced, massive plates.
Public/Granted literature
- US20050017310A1 Methods of forming silicide films in semiconductor devices Public/Granted day:2005-01-27
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