发明授权
US07169707B2 Method of manufacturing package substrate with fine circuit pattern using anodic oxidation
失效
使用阳极氧化制造具有精细电路图案的封装衬底的方法
- 专利标题： Method of manufacturing package substrate with fine circuit pattern using anodic oxidation
- 专利标题（中）： 使用阳极氧化制造具有精细电路图案的封装衬底的方法
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申请号： US11011401申请日： 2004-12-13
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公开(公告)号： US07169707B2公开(公告)日： 2007-01-30
- 发明人: Duck Young Maeng , Byung Kook Sun , Tae Hoon Kim , Jee Soo Mok , Jong Suk Bae , Yoong Oh , Chang-Kyu Song , Suk-Hyeon Cho
- 申请人： Duck Young Maeng , Byung Kook Sun , Tae Hoon Kim , Jee Soo Mok , Jong Suk Bae , Yoong Oh , Chang-Kyu Song , Suk-Hyeon Cho
- 申请人地址： KR Kyunggi-Do
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Kyunggi-Do
- 代理机构： Darby & Darby
- 优先权： KR10-2004-0066799 20040824
- 主分类号： H01L21/302
- IPC分类号： H01L21/302
摘要：
Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other. Further, by electroplating portions provided between the oxidation layers with copper or filling conductive paste between the oxidation layers using a screen, a package substrate having a fine circuit pattern is achieved.