公开(公告)号：US08549744B2

公开(公告)日：2013-10-08

申请号：US11727838

申请日：2007-03-28

申请人： Hee-Bum Shin ,  Dong-Jin Park ,  Jee-Soo Mok ,  Jong-Suk Bae ,  Ki-Hwan Kim

发明人： Hee-Bum Shin ,  Dong-Jin Park ,  Jee-Soo Mok ,  Jong-Suk Bae ,  Ki-Hwan Kim

IPC分类号： H01K3/10

CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K3/423 ,  H05K3/4623 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/09563 ,  H05K2203/0733 ,  H05K2203/1492 ,  Y10T29/49165

摘要： The present invention provides a method for manufacturing a printed circuit board and a print circuit board manufactured thereby, in which through holes of a core board are filled by reverse pulse plating so that it allows to manufacture a core board having greater than 100 μm of a thickness which has been a processing limitation with conventional technologies and form bumps on a thick insulation layer, which has been difficult till now, and thus providing resistance against pressure of paste bumps produced during stacking due to the increased strength of a core board, convenience to join between layers, excellent heat-releasing effect, and collectively stacking of core boards, which was not possible with conventional methods.

摘要翻译： 本发明提供一种制造印刷电路板的方法和由此制造的印刷电路板，其中通过反向脉冲电镀填充芯板的通孔，从而允许制造具有大于100μm的 在现有技术难以达到现有技术的加工限制以及在厚绝缘层上形成凸块的厚度，由于芯板的强度提高，堆叠时产生的焊膏凸起的压力抵抗力提高， 层之间的连接，散热效果优异，并且集体堆叠芯板，这对于常规方法是不可能的。

公开(公告)号：US07169707B2

公开(公告)日：2007-01-30

申请号：US11011401

申请日：2004-12-13

申请人： Duck Young Maeng ,  Byung Kook Sun ,  Tae Hoon Kim ,  Jee Soo Mok ,  Jong Suk Bae ,  Yoong Oh ,  Chang-Kyu Song ,  Suk-Hyeon Cho

发明人： Duck Young Maeng ,  Byung Kook Sun ,  Tae Hoon Kim ,  Jee Soo Mok ,  Jong Suk Bae ,  Yoong Oh ,  Chang-Kyu Song ,  Suk-Hyeon Cho

IPC分类号： H01L21/302

CPC分类号： H01L21/486 ,  H01L23/142 ,  H01L2924/0002 ,  H05K3/205 ,  H05K3/207 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4647 ,  H05K2203/0152 ,  H05K2203/0315 ,  H01L2924/00

摘要： Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other. Further, by electroplating portions provided between the oxidation layers with copper or filling conductive paste between the oxidation layers using a screen, a package substrate having a fine circuit pattern is achieved.

摘要翻译： 本文公开了使用阳极氧化制造具有精细电路图案的封装衬底的方法。 通过对通过掩模工艺开放的金属芯进行阳极氧化，在金属芯的开放区域中形成氧化层，以使电路图案的部分彼此绝缘。 此外，通过使用屏幕将设置在氧化层之间的电镀部分用铜或在氧化层之间填充导电浆料，实现了具有精细电路图案的封装衬底。

公开(公告)号：US20070235220A1

公开(公告)日：2007-10-11

申请号：US11727838

申请日：2007-03-28

申请人： Hee-Bum Shin ,  Dong-Jin Park ,  Jee-Soo Mok ,  Jong-Suk Bae ,  Ki-Hwan Kim

发明人： Hee-Bum Shin ,  Dong-Jin Park ,  Jee-Soo Mok ,  Jong-Suk Bae ,  Ki-Hwan Kim

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K3/423 ,  H05K3/4623 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/09563 ,  H05K2203/0733 ,  H05K2203/1492 ,  Y10T29/49165

摘要： The present invention provides a method for manufacturing a printed circuit board and a print circuit board manufactured thereby, in which through holes of a core board are filled by reverse pulse plating so that it allows to manufacture a core board having greater than 100 μm of a thickness which has been a processing limitation with conventional technologies and form bumps on a thick insulation layer, which has been difficult till now, and thus providing resistance against pressure of paste bumps produced during stacking due to the increased strength of a core board, convenience to join between layers, excellent heat-releasing effect, and collectively stacking of core boards, which was not possible with conventional methods.

摘要翻译： 本发明提供一种制造印刷电路板的方法和由此制造的印刷电路板，其中通过反向脉冲电镀填充芯板的通孔，从而允许制造具有大于100μm的 在现有技术难以达到现有技术的加工限制以及在厚绝缘层上形成凸块的厚度，由于芯板的强度提高，堆叠时产生的焊膏凸起的压力抵抗力提高， 层之间的连接，散热效果优异，并且集体堆叠芯板，这对于常规方法是不可能的。