发明授权
- 专利标题: Lead-free solder
- 专利标题(中): 无铅焊料
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申请号: US10682305申请日: 2003-10-10
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公开(公告)号: US07172726B2公开(公告)日: 2007-02-06
- 发明人: Tsukasa Ohnishi
- 申请人: Tsukasa Ohnishi
- 申请人地址: JP Tokyo
- 专利权人: Senju Metal Industry Co., Ltd.
- 当前专利权人: Senju Metal Industry Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理商 Michael Tobias
- 优先权: JP2002-300028 20021015
- 主分类号: C22C13/00
- IPC分类号: C22C13/00 ; B23K35/26
摘要:
A lead-free solder which is significantly less susceptible to copper leaching when used in a molten state in which coil ends of copper wire are dipped comprises 1.5–8 mass % of Cu, 0.01–2 mass % of Co, optionally 0.01–1 mass % of Ni, and a remainder of Sn and has a liquidus temperature of 420° C. or below. The solder may further comprise at least one oxidation-inhibiting element selected from the group consisting of P, Ge, and Ga in a total amount of 0.001–0.5 mass %, and/or Ag in an amount of 0.05–2 mass % as a wettability-improving element.
公开/授权文献
- US20040115088A1 Lead-free solder 公开/授权日:2004-06-17